Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Hubert Wieser"'
Autor:
Martin Schneider-Ramelow, V. Bader, Gerd Jungmann, S. Voges, Jeremias Pauls, Karl-Friedrich Becker, Tanja Braun, Mathias Minkus, Hubert Wieser, K-D. Lang
Publikováno v:
International Symposium on Microelectronics. 2017:000182-000187
The constant drive of microelectronics towards ever higher degrees of integration leads to a wide variety of concepts to yield smallest packages with maximized functionality – while side by side packaging leads to thinnest packages a small footprin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::831fa1e1084a2cd230786883d4488bf4
https://doi.org/10.4071/isom-2017-wa15_077
https://doi.org/10.4071/isom-2017-wa15_077
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
This paper presents a new high power package for automotive products. It provides innovative interconnecting concepts for multi-die integration of different semiconductor technologies in a single package with automotive grade reliability. Cost effect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c3f5fce698f77eac71628e6ae5fcc4a
https://doi.org/10.1109/iemt.2008.5507871
https://doi.org/10.1109/iemt.2008.5507871