Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Hualiang Shi"'
Autor:
Yan Li, Hualiang Shi
Publikováno v:
Advanced Driver Assistance Systems and Autonomous Vehicles ISBN: 9789811950520
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7b793d9d8ba1db0463e6729fec5ab34
https://doi.org/10.1007/978-981-19-5053-7_14
https://doi.org/10.1007/978-981-19-5053-7_14
Autor:
Hualiang Shi, Lixin Jia
Publikováno v:
Advanced Driver Assistance Systems and Autonomous Vehicles ISBN: 9789811950520
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efdb0b717b2dbb4c49bcca9b5396c1ab
https://doi.org/10.1007/978-981-19-5053-7_13
https://doi.org/10.1007/978-981-19-5053-7_13
Publikováno v:
3D Microelectronic Packaging ISBN: 9789811570896
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::34328a5304a13a2af61d90fecb1ea4d6
https://doi.org/10.1007/978-981-15-7090-2_7
https://doi.org/10.1007/978-981-15-7090-2_7
Autor:
Yan Li, Hualiang Shi
This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, an emerging and rapidly growing area. The book
Autor:
Ya Yan Lu, Hualiang Shi
Open subwavelength cylindrical resonators of finite height are widely used in various photonics applications. Circular cylindrical resonators are particularly important in nanophotonics, since they are relatively easy to fabricate and can be designed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e5bfcfc52d258b503d65fe20de8e1d25
http://arxiv.org/abs/1907.00340
http://arxiv.org/abs/1907.00340
Publikováno v:
Optics express. 26(24)
Bowtie structures of metallic nanoparticles are very effective in producing strong local fields needed in many applications. Existing numerical studies on bowtie structures are limited to those with rounded tips. Due to the field singularities at sha
Autor:
Erasenthiran Poonjolai, Hualiang Shi
Publikováno v:
3D Microelectronic Packaging ISBN: 9783319445847
Through-Silicon-Via (TSV) wafer processes have been reviewed by several authors previously, including temporary adhesive wafer bonding, high aspect ratio silicon etch, and wafer singulation. This chapter starts with a brief overview of TSV wafer fabr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0368ee575e8a9d04e1df1ed6d58d8b68
https://doi.org/10.1007/978-3-319-44586-1_5
https://doi.org/10.1007/978-3-319-44586-1_5
Autor:
Hualiang Shi, Denis Shamiryan, Jean‐François de Marneffe, Huai Huang, Paul S. Ho, Mikhail R. Baklanov
Publikováno v:
Advanced Interconnects for ULSI Technology. :79-128
Autor:
Michael L. McSwiney, J. Bao, Mansour Moinpour, Huai Huang, Paul S. Ho, Michael D. Goodner, Hualiang Shi, Grant M. Kloster
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 28:207-215
Oxygen plasma damage to blanket and patterned ultralow-κ (ULK) dielectric surfaces was investigated by examining the effect of plasma species and dielectric materials. Blanket ULK films and patterned structures were treated by O2 plasma in a remote
Publikováno v:
2015 9th International Congress on Advanced Electromagnetic Materials in Microwaves and Optics (METAMATERIALS).
An efficient numerical method is developed to analyze light transmission through subwavelength apertures in metallic films, where the apertutres can have arbitrary cross sections and be surrounded by many grooves. The method is tailor-made for three-