Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Hua-Yu Chang"'
Autor:
Hua-Yu Chang, 張華宇
102
As the design complexity grows dramatically, late design changes are nearly in- evitable to handle specification modifications and/or rectify design errors. Metal- only engineering change order (ECO), which revises only metal layers to reali
As the design complexity grows dramatically, late design changes are nearly in- evitable to handle specification modifications and/or rectify design errors. Metal- only engineering change order (ECO), which revises only metal layers to reali
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/99824736700066081098
Autor:
Hua-Yu Chang, 張華宇
98
This study examined the feasibility and operation performance of reforming of synthesis gas (syngas, CO and H2) via high pressure catalytic packed bed (HPCPB) process. The effects of variation of temperature (T), change of H2/CO ratio, additi
This study examined the feasibility and operation performance of reforming of synthesis gas (syngas, CO and H2) via high pressure catalytic packed bed (HPCPB) process. The effects of variation of temperature (T), change of H2/CO ratio, additi
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/28947521329678616302
Autor:
Hua-Yu Chang, 張華宇
89
This paper proposes a method about the three-dimensional geometric metamorphosis. In order to balance between automatic generation and manual interaction and produce a satisfying metamorphosis, we use the skeletons of objects to assist and re
This paper proposes a method about the three-dimensional geometric metamorphosis. In order to balance between automatic generation and manual interaction and produce a satisfying metamorphosis, we use the skeletons of objects to assist and re
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/08804217620216643571
Publikováno v:
Proceedings of the 2022 International Symposium on Physical Design.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec8e5ad757834f8696bcd6c51688b59f
https://doi.org/10.1145/3505170.3511474
https://doi.org/10.1145/3505170.3511474
Autor:
Hua-Yu Chang, Iris Hui-Ru Jiang
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 36:2080-2092
Multiple patterning lithography has been recognized as one of the most promising solutions, in addition to extreme ultraviolet lithography, directed self-assembly, nanoimprint lithography, and electron beam lithography, for advancing the resolution l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b854610d271dee0f186003f6a5f7f38c
https://doi.org/10.1109/tcad.2017.2681068
https://doi.org/10.1109/tcad.2017.2681068
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 32:1722-1733
Due to the rapidly increasing design complexity in modern IC designs, metal-only engineering change order (ECO) becomes inevitable to achieve design closure with a low respin cost. Traditionally, preplaced redundant standard cells are regarded as spa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::418f2fb66c6938714f24bfe069cb6435
https://doi.org/10.1109/tcad.2013.2272540
https://doi.org/10.1109/tcad.2013.2272540
Autor:
Hua-Yu Chang, Iris Hui-Ru Jiang
Publikováno v:
DAC
Multiple patterning lithography has been recognized as one of the most promising solutions, in addition to extreme ultraviolet lithography, directed self-assembly, nanoimprint lithography, and electron beam lithography, for advancing the resolution l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c78a24450ebf805c5c84fe4f5a68db97
https://doi.org/10.1145/2897937.2898048
https://doi.org/10.1145/2897937.2898048
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 31:1857-1866
Due to the rapidly increasing design complexity in modern integrated circuit design, more and more timing failures are detected at late stages. Without deferring time-to-market, metal-only engineering change order (ECO) is an economical technique to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ce70765c3013e2662514dc784be5f2d
https://doi.org/10.1109/tcad.2012.2209117
https://doi.org/10.1109/tcad.2012.2209117
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 20:581-592
Due to excessive current densities, electromigration (EM) may trigger a permanent open- or short-circuit failure in signal wires or power networks in analog or mixed-signal circuits. As the feature size keeps shrinking, this effect becomes a key reli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c5cd266dfc76ce42f859fd9751b7ab2
https://doi.org/10.1109/tvlsi.2011.2116049
https://doi.org/10.1109/tvlsi.2011.2116049
Autor:
Hua-Yu Chang, Iris Hui-Ru Jiang
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 20:485-497
To ease the time-to-market pressure and save the photomask cost, metal-only ECO realizes the last-minute design changes by revising the photomasks of metal layers only. This task is challenging because the pre-injected spare cells are limited in numb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2aac55a388d509768c62014fe5c7826
https://doi.org/10.1109/tvlsi.2011.2104377
https://doi.org/10.1109/tvlsi.2011.2104377