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Autor:
Jia-Juen Ong, Dinh-Phuc Tran, Hua-Jing Huang, Wei-Lan Chiu, Shih-Chi Yang, Wen-Wei Wu, Hsiang-Hung Chiang, Chih Chen
Publikováno v:
Journal of Materials Research and Technology, Vol 33, Iss , Pp 9811-9819 (2024)
In this study, nanotwinned Cu (NT-Cu) and SiO2 hybrid joints were fabricated at 200 °C and subjected to thermal cycling tests (TCTs) up to 2000 cycles for the reliability evaluation. It is intriguing that the measured electrical resistance of the Cu
Externí odkaz:
https://doaj.org/article/27a26ac6f0314e3eb7f4d342d3284941