Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Hsun-Fa Li"'
Publikováno v:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4eb6f20c0dfabf52f241e9c8d25c70db
https://doi.org/10.1109/impact56280.2022.9966717
https://doi.org/10.1109/impact56280.2022.9966717
Publikováno v:
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Voids in solder joints are considered one of main defects in Printed Circuit Board Assemblies (PCBAs). The reason for the formation of solder voids is mainly caused by the organic volatile matter in the flux of solder paste that cannot effused timely
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a856ce683581c4ca1fc4d209f3078e21
https://doi.org/10.1109/impact.2018.8625744
https://doi.org/10.1109/impact.2018.8625744
Publikováno v:
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Miniaturization is a way to make product smaller, thinner and lighter. Designer can put more components on the same layout area to have more functions or reduce the PCBA (Printed Circuit Board Assembly) size via miniaturization technology. So USI kee
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa43b8a4a65df23c2ea9afc632518e16
https://doi.org/10.1109/impact.2018.8625842
https://doi.org/10.1109/impact.2018.8625842
Autor:
Chun-Chi Chiu, Hsun-Fa Li
Publikováno v:
2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
There are no criteria for Bottom Terminal Component (BTC) solder void except 30% area for BGA solder joints in IPC-A-610F. It means supplier and customer should co-define the criteria for their own products. The solder void ratio control is related t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9575e7a053fd1da5ea097b03e45e75a4
https://doi.org/10.1109/impact.2017.8255945
https://doi.org/10.1109/impact.2017.8255945
Autor:
Chun-Chi Chiu, Hsun-Fa Li
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
The article also investigates the min. solder volume request for solving Gold embrittlement issue in the limited condition. Gold (Au) embrittlement was known and had been studied for a long time. It will reduce the solder joint toughness not just onl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18105219cea28d221f0baffc114a6a96
https://doi.org/10.1109/impact.2016.7800012
https://doi.org/10.1109/impact.2016.7800012
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Electronic products are becoming lighter, thinner and more compact as the diversity of product grows and functions become more powerful. As a result, the size of Surface Mount Devices (SMDs) used for the Surface Mount Technology (SMT) become smaller
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41bd2b60e99e9a2453c7b235a363b35d
https://doi.org/10.1109/impact.2016.7800005
https://doi.org/10.1109/impact.2016.7800005
Publikováno v:
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
Fine pitch(≦0.5mm) BGAs were assembled on many kinds of products for many years, such as Smart Handheld Device, Mobile Phone, Network Device, Notebook main board, etc. Normally the BGA defects are solder joint bridge, solder joint open, and BGA sol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6effa7a0dc8bdec70fe18d85bb454dfa
https://doi.org/10.1109/impact.2009.5382257
https://doi.org/10.1109/impact.2009.5382257
Publikováno v:
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
Anisotropic Conductive Paste / Anisotropic Conductive Adhesive (ACP/ACA) type of Flex-on-Board (FOB) bonding method ensures good electricity between the flex electrode and organic substrate electrode for fine pitch ≤0.3mm design layout. ACP is an a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3aebcc279dcf180478ae5eed5dcea6bd
https://doi.org/10.1109/impact.2009.5382173
https://doi.org/10.1109/impact.2009.5382173
Publikováno v:
2009 4th International Microsystems, Packaging, Assembly & Circuits Technology Conference; 2009, p602-605, 4p