Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Hsun Ou"'
Autor:
Hsun Ou, Wu-Chien Chien, Chi-Hsiang Chung, Hsin-An Chang, Yu-Chen Kao, Pei-Chuan Wu, Nian-Sheng Tzeng
Publikováno v:
Frontiers in Aging Neuroscience, Vol 13 (2021)
Background:Chlamydia pneumoniae (CPn) is a common community-acquired pneumonia. In the literature, CPn infection is demonstrated to exhibit an association with Alzheimer dementia (AD). We executed the present nationwide, population-based research wit
Externí odkaz:
https://doaj.org/article/e7171d71cabc416aac3d74a9e94be395
Autor:
Hsun Ou, Yi-Wei Yeh
Publikováno v:
American Journal of Therapeutics; Jul/Aug2024, Vol. 31 Issue 4, p502-504, 3p
Publikováno v:
Frontiers in Physiology, Vol 11 (2020)
Obstructive sleep apnea, similar to intermittent hypoxia (IH) during sleep, is associated with laryngeal airway hyperreactivity (LAH). IH-induced laryngeal oxidative stress may contribute to LAH, but the underlying mechanism remains unknown. Consciou
Externí odkaz:
https://doaj.org/article/0e99c32c7bfb4c17a1159544ad71f0a0
Publikováno v:
American Journal of Therapeutics.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::defe8a79bb8e82b2eb66ea23c608dad9
https://doi.org/10.1097/mjt.0000000000001638
https://doi.org/10.1097/mjt.0000000000001638
Autor:
Hsun Ou, Chun-Yen Chen
Publikováno v:
American journal of therapeutics.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2a37798dcecb636ed03af30698c7213a
https://pubmed.ncbi.nlm.nih.gov/35551131
https://pubmed.ncbi.nlm.nih.gov/35551131
Publikováno v:
American journal of therapeutics. 28(5)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e0865651a0a326160c3bc6ef26e7b3f3
https://pubmed.ncbi.nlm.nih.gov/34224426
https://pubmed.ncbi.nlm.nih.gov/34224426
Autor:
San-Yuan Huang, Hsun Ou
Publikováno v:
American journal of therapeutics. 29(6)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::845c7c9c2ee78dd82507df6c0d0d5796
https://pubmed.ncbi.nlm.nih.gov/33395053
https://pubmed.ncbi.nlm.nih.gov/33395053
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
The new high-density non-core package substrate needs to carry out the ultra-deep etching and thinning process of more than 20 microns when drawing the conductive graphics circuit and requires the smooth and uniform surface of the substrate after thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72230995d8965b9b2aa62d21396c9d05
https://doi.org/10.1109/icept50128.2020.9202558
https://doi.org/10.1109/icept50128.2020.9202558
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
As an important component of integrated circuit, package substrate is an essential intermediate product for electrical interconnection between chip and printed circuit board. The functions of package substrate are protect circuit board, dissipate hea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec0081d0241a3bd40905eddd2db3f635
https://doi.org/10.1109/icept50128.2020.9202412
https://doi.org/10.1109/icept50128.2020.9202412
Publikováno v:
American Journal of Therapeutics. 29:e676-e677
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::12c6835230ad660627103fa23b435c15
https://doi.org/10.1097/mjt.0000000000001304
https://doi.org/10.1097/mjt.0000000000001304