Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Hsuan-Ling Hsu"'
Autor:
Hsuan-Ling Hsu, 徐萱齡
105
Nowadays, development of microelectronic products follows the trend of miniaturization with the progress of technology. Therefore, the size of the solder joints shrinks and the reliability issue can not be avoided in semiconductor industry.
Nowadays, development of microelectronic products follows the trend of miniaturization with the progress of technology. Therefore, the size of the solder joints shrinks and the reliability issue can not be avoided in semiconductor industry.
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/04732656932672092000
Autor:
Hsuan-Ling Hsu, 許軒領
96
This paper proposes Shallow Semantic Question Analysis Model and Shallow Semantic Answer Inference Model to address some general medical questions according to the observation and analysis of user questions. Considering the condition that gen
This paper proposes Shallow Semantic Question Analysis Model and Shallow Semantic Answer Inference Model to address some general medical questions according to the observation and analysis of user questions. Considering the condition that gen
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/75194482529018595307
Publikováno v:
Materials Chemistry and Physics. 225:153-158
The existence of voids in the solder joints has been a serious reliability problem in microelectronics. A comprehensive understanding of the formation mechanism of voids is the cornerstone to solve the problem. This study reports an unusual phenomeno
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::453eab743733c1614f40820934a1edf0
https://doi.org/10.1016/j.matchemphys.2018.12.036
https://doi.org/10.1016/j.matchemphys.2018.12.036
Publikováno v:
Journal of Materials Science: Materials in Electronics. 29:12842-12849
The use of functional additives in the electroplating process results in an impurity incorporation in the Cu plated layer. A high level of impurity residual has been recognized as a severe reliability problem to the Sn/Cu joints because voids are pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9eebc4bc5818609d8d8f64c6efc5da37
https://doi.org/10.1007/s10854-018-9403-7
https://doi.org/10.1007/s10854-018-9403-7
Autor:
Wei-Ping Dow, Hsuan-Ling Hsu, Tai-Yi Yu, Hsi-Kuei Cheng, Hsuan Lee, Chih-Ming Chen, Kuo-Chio Liu
Publikováno v:
Journal of The Electrochemical Society. 163:D734-D741
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9cedf4e293417792312bdf57f63e3be
https://doi.org/10.1149/2.0091614jes
https://doi.org/10.1149/2.0091614jes