Zobrazeno 1 - 10
of 31
pro vyhledávání: '"Hsu-Shen Chu"'
Publikováno v:
Journal of Materials Science. 57:19396-19404
Recently, thermoelectric (TE) devices have attracted much attention because they have no moving parts, simple structures, high reliability, and environmental friendly, when compared to other green energy techniques. In this paper, we report a novel t
Publikováno v:
Journal of Alloys and Compounds. 731:111-117
Bi2(Se0.1Te0.9)3and Ni are the most commonly used N-type thermoelectric material and barrier layer in commercial thermoelectric modules. This study systematically examines the interfacial reactions between Ni and Bi2(Se0.1Te0.9)3and its constituent m
Autor:
Chun Hsien Wang, Hsu Shen Chu, Hsien Chien Hsieh, Subhendu Chakroborty, Albert T. Wu, Tse Hsiao Lee, Wen Chih Lin
Publikováno v:
Journal of Alloys and Compounds. 728:1023-1029
This work describes an in-depth study on the electroless deposition of Co–P via the addition of a reductant to a solution on a roughened, sensitized, and activated n-PbTe thermoelectric substrate. The Co–P layer facilitates the bonding of the the
Autor:
Chih Yu Wu, Ting-ruei Yang, Tz-wen Liou, Sinn-wen Chen, Jenn-dong Huang, Hsu-shen Chu, Haw-wen Hsiao
Publikováno v:
Journal of Alloys and Compounds. 686:847-853
The interfacial reactions between the Ni barrier layer and the popularly used P-type (Bi0.25Sb0.75)2Te3 and N-type Bi2(Te0.9Se0.1)3 thermoelectric substrates are examined at 300 °C and 250 °C. A NiTe2 phase with significant Sb solubility, or a tern
Autor:
Yan-Cheng Lin, Sheng-Chi Chen, Hsu-Shen Chu, Tung-Han Chuang, Chao-Chi Jain, J. D. Hwang, Chung-Lin Yang, Jing-Yi Huang
Publikováno v:
Metallurgical and Materials Transactions A. 47:4767-4776
A Bi0.5Sb1.5Te3 thermoelectric material electroplated with a Ni barrier layer and a Ag reaction layer was bonded with a Ag-coated Cu electrode at low temperatures of 448 K (175 °C) to 523 K (250 °C) using a 4-μm-thick In interlayer under an extern
Publikováno v:
Metallurgical and Materials Transactions E. 3:281-290
This study determines the liquidus projections of both Bi-Se-Ga and Bi-Se-Te ternary systems which are constituent ternary systems of promising Bi-Se-Te-Ga thermoelectric materials. Ternary Bi-Se-Ga and Bi-Se-Te alloys are prepared. Their primary sol
Autor:
K. T. Lee, Yu-Chuan Lin, Tung-Han Chuang, Cheng-Ting Hsu, Sheng-Chi Chen, J. D. Hwang, Hsu-Shen Chu
Publikováno v:
Journal of Electronic Materials. 45:4935-4942
The ZnSb intermetallic compound may have thermoelectric applications because it is low in cost and environmentally friendly. In this study, a Zn4Sb3 thermoelectric element coated with a Ni barrier layer and a Ag reaction layer was bonded with a Ag-co
Autor:
Hsu-Shen Chu, Feng Hao, Jikun Chen, Lidong Chen, Tiansong Zhang, Shengqiang Bai, Dudi Ren, Xun Shi, Ping Lu, Qihao Zhang, Tong Xing, Tang Yunshan, Pengfei Qiu
Publikováno v:
Energy & Environmental Science. 9:3120-3127
By suppressing intrinsic excitation in p-type Bi2Te3-based materials, we report maximum and average zT values of up to 1.4 and 1.2 between 100 and 300 °C, respectively. Thermoelectric modules based on these high performance materials show energy con
Autor:
Albert T. Wu, Chun Hsien Wang, Tian-Wey Lan, Hsien Chien Hsieh, Tse Hsiao Lee, Yang-Yuan Chen, Hsu Shen Chu
Publikováno v:
Materials Chemistry and Physics. 246:122848
PbTe-based alloys are potential mid-temperature thermoelectric materials due to their excellent thermoelectric properties. Formation of intermetallic deteriorates mechanical joint strength and thermoelectric performance as well. In the present work,