Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Hsu-Chieh Lee"'
Autor:
Hsu-Chieh Lee, 李緒頡
99
In today''s IC production, the design processes of chip, package, and board are separate from each other. However, the lack of information from other domains dramatically increases the design difficulty and reduces the quality of the product.
In today''s IC production, the design processes of chip, package, and board are separate from each other. However, the lack of information from other domains dramatically increases the design difficulty and reduces the quality of the product.
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/48940177718280905195
Autor:
Wen-Chi Tseng, Ming-Jun Wang, Yi-Hung Wu, Hsu-Chieh Lee, Hong-Yi Fang, Chung-Ting Hsu, Chao-Nan Chen, Tsuei-Yun Fang
Publikováno v:
International journal of biological macromolecules. 112
d -Allulose 3-epimerase (DAEase) catalyzes the epimerization between d -fructose and d -allulose. We had PCR-cloned and overexpressed the gene encoding Agrobacterium sp. ATCC 31749 DAEase (AsDAEase) in Escherichia coli. A high yield of active AsDAEas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::27977235fd7cff079298da3542673092
https://pubmed.ncbi.nlm.nih.gov/29427680
https://pubmed.ncbi.nlm.nih.gov/29427680
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 32:1347-1356
To accommodate the ever-growing pin number of complex printed circuit board (PCB) designs, the staggered pin array is introduced for modern designs with higher pin density. However, the escape routing for staggered pin arrays, which is a key componen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de6be9b79c7ceb11faafe16de6986e47
https://doi.org/10.1109/tcad.2013.2259539
https://doi.org/10.1109/tcad.2013.2259539
Publikováno v:
ASP-DAC
For high-performance synchronous systems, non-uniform/non-ideal supply voltages of buffers (e.g., due to IRdrop) may incur a large clock skew and thus serious performance degradation. This paper addresses this problem and presents the first symmetric
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e072b657ee7a05dd8f9e3f1497c68e95
https://doi.org/10.1109/aspdac.2013.6509637
https://doi.org/10.1109/aspdac.2013.6509637
Autor:
Yao-Wen Chang, Chin-Fang Shen, Chen-Feng Chang, Hsu-Chieh Lee, Webber Lee, Yuan-Kai Ho, I-Jye Lin
Publikováno v:
DAC
The flip-chip packaging is introduced for modern IC designs with higher integration density and larger I/O counts. It is necessary to consider routing obstacles for modern flip-chip designs, where the obstacles could be regions blocked for signal int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::81d67ba3e2149b5a9413af76a37b7800
https://doi.org/10.1145/2228360.2228558
https://doi.org/10.1145/2228360.2228558
Autor:
Hsu-Chieh Lee, Yao-Wen Chang
Publikováno v:
DAC
In today's IC production, the design processes of chips, packages, and boards are typically separate from each other. The lack of information from other domains causes significant design convergence problems and greatly reduces design quality. In thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6cdb9cdcd00b7179e20f7caf3b9fed2d
https://doi.org/10.1145/2228360.2228557
https://doi.org/10.1145/2228360.2228557
Publikováno v:
2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b4bfd616fd7c5e120f82297ab40d961
https://doi.org/10.1109/iccad.2010.5653698
https://doi.org/10.1109/iccad.2010.5653698
Publikováno v:
2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::792a4b7f9285292965d6e979b24ee36b
https://doi.org/10.1109/iccad.2010.5653754
https://doi.org/10.1109/iccad.2010.5653754
Autor:
Po-Wei Lee, Hsu-Chieh Lee, Yuan-Kai Ho, Yao-Wen Chang, Chen-Feng Chang, I-Jye Lin, Chin-Fang Shen
Publikováno v:
DAC: Annual ACM/IEEE Design Automation Conference; Jun2012, p1088-1093, 6p
Publikováno v:
2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD); 2011, p306-309, 4p