Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Hsiu-Ting Lee"'
Publikováno v:
International Symposium for Testing and Failure Analysis.
Transmission electron microscopy (TEM) plays an important role in the structural analysis and characterization of materials for process evaluation and failure analysis in the integrated circuit (IC) industry as device shrinkage continues. It is well
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::934319c0e3e81296cf2f33f52d4c78ea
https://doi.org/10.31399/asm.cp.istfa2015p0318
https://doi.org/10.31399/asm.cp.istfa2015p0318
Autor:
Jian-Shing Luo, Hsiu Ting Lee
Publikováno v:
International Symposium for Testing and Failure Analysis.
Several methods are used to invert samples 180 deg in a dual beam focused ion beam (FIB) system for backside milling by a specific in-situ lift out system or stages. However, most of those methods occupied too much time on FIB systems or requires a s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ef17058ee3aff48a42a96a38b8ebbc4
https://doi.org/10.31399/asm.cp.istfa2014p0400
https://doi.org/10.31399/asm.cp.istfa2014p0400
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper provides details of a novel method developed to cover a tiny epoxy layer as an intermediate buffer on the site-specific surface defect using a micro-bush on the tip of a glass needle in a plucking system without sample surface damage and l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9008996a6dc1760c0807405744650e42
https://doi.org/10.31399/asm.cp.istfa2009p0126
https://doi.org/10.31399/asm.cp.istfa2009p0126