Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Hsiu-Min Lin"'
Autor:
Hsiu-min Lin, 林秀忞
97
Wireless sensor network has been widely applied in business, medical and even in our daily life. Among technologies of wireless sensor network, ZigBee is a new communication standard based on the IEEE 802.15.4. Due to the reliability, cost-ef
Wireless sensor network has been widely applied in business, medical and even in our daily life. Among technologies of wireless sensor network, ZigBee is a new communication standard based on the IEEE 802.15.4. Due to the reliability, cost-ef
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/50882430975098035858
Autor:
Hsiu-Min Lin, 林修民
93
In this paper, we propose a reconfigurable decoder architecture suitable for generic irregular LDPC (Low Density Parity Check) decoding. First of all, we study LDPC property in detail. Secondly, we survey the LDPC various decoding algorithms
In this paper, we propose a reconfigurable decoder architecture suitable for generic irregular LDPC (Low Density Parity Check) decoding. First of all, we study LDPC property in detail. Secondly, we survey the LDPC various decoding algorithms
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/05636232778710555513
Publikováno v:
Proceedings of International Conference on Artificial Life and Robotics. 21:96-99
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e76c269651d30816f242a3415c599b0e
https://doi.org/10.5954/icarob.2016.os1-2
https://doi.org/10.5954/icarob.2016.os1-2
Autor:
Yi-Hsin Wu, De-Hui Wang, Yu-Hui Wu, Cheng-Ying Ho, Jenq-Gong Duh, Zhi-Wei Lin, Huei-Cheng Hong, Hsiu-Min Lin, Jun-Ren Lin, Wen-Lin Chen
Publikováno v:
Microelectronics Reliability. 55:231-237
The criteria of mechanical reliability in solder joints can be identified and described by comparative evaluation via drop test and high speed pendulum impact test. Systematic samples of assembly and attachment joints with various Pd additions were e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e73d46ef3f3f91938b1d8e66eca9b659
https://doi.org/10.1016/j.microrel.2014.09.003
https://doi.org/10.1016/j.microrel.2014.09.003
Autor:
Hsiu-Min Lin, Jenq-Gong Duh
Publikováno v:
Surface and Coatings Technology. 237:445-449
The feasibility of using electroplated Ni–xZn films was evaluated for a new application as the under bump metallization. Considering the alloy films in electroplating process, determining the deposition potential (affecting nucleation) and current
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::be997dd31ae3f7aab8ec7d83213f810e
https://doi.org/10.1016/j.surfcoat.2013.08.056
https://doi.org/10.1016/j.surfcoat.2013.08.056
Autor:
Wen-Liang Chen, Chu-Chung Chou, Yan-Ren Lin, Chin-Fu Chang, Hsiu-Min Lin, Mei-Chueh Yang, Tzeng-Jih Lin, Hsin-Liang Liu, Kuan-Ting Liu
Publikováno v:
Journal of Acute Medicine. 3:6-10
Objective Paraquat intoxication has a high mortality rate. The purpose of this study is to identify the clinical features and predictors of early mortality within 72 hours among individuals with paraquat intoxication in central Taiwan. Methods This r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cb7019df846303afc66e08046306b4e4
https://doi.org/10.1016/j.jacme.2013.01.001
https://doi.org/10.1016/j.jacme.2013.01.001
Autor:
Yan-Ren Lin, Kuan-Ting Liu, Chin-Fu Chang, Tzeng-Jih Lin, Wen-Liang Chen, Chu-Chung Chou, Han-Ping Wu, Hsin-Liang Liu, Hsiu-Min Lin
Publikováno v:
Journal of Neuroscience and Neuroengineering. 2:61-65
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f4084a27b682991986a57c58a196588
https://doi.org/10.1166/jnsne.2013.1033
https://doi.org/10.1166/jnsne.2013.1033
Autor:
Jenq-Gong Duh, Hsiu-Min Lin
Publikováno v:
Surface and Coatings Technology. 206:1941-1946
This work aims to investigate the interfacial reaction under liquid reactions of Sn–3.0Ag–0.5Cu (SAC305) joints with Ni–xZn films by sputtering. The surface roughness and residual stress of the Ni–xZn film, which was regarded to an under bump
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eeb5c5856ece1fb70a42791b034e4426
https://doi.org/10.1016/j.surfcoat.2011.08.055
https://doi.org/10.1016/j.surfcoat.2011.08.055
Publikováno v:
Surface and Coatings Technology. 205:1460-1464
Recently great emphases have been placed on material characteristics, such as hardness and toughness in development of protective hard coatings. This work aims to investigate the microstructures and mechanical properties of rather thick Ti–Si–C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::deceefe0ebb9b70a7c95b21789bd817f
https://doi.org/10.1016/j.surfcoat.2010.07.070
https://doi.org/10.1016/j.surfcoat.2010.07.070
Publikováno v:
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
This study aims to investigate the feasibility of sputtered Ni-xZn films for application as the under bump metallization (UBM). The interfacial reaction under liquid reactions of Sn-3.0Ag-0.5Cu (SAC305) joints with Ni-Zn films will be evaluated. Vari
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d95da67e94cb94fa0add29584189d68f
https://doi.org/10.1109/icept.2011.6066853
https://doi.org/10.1109/icept.2011.6066853