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Publikováno v:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
SiP (System in Package) module products are always a focus of USI’s R&D efforts. USI’s efforts in module development have been focused on wireless modules since 2000, including WiFi, Bluetooth, GPS and WWAN (GSM/WCDMA/LTE). Products have been pou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::031a74be5df835151e13f43c100e494b
https://doi.org/10.1109/impact47228.2019.9024977
https://doi.org/10.1109/impact47228.2019.9024977
