Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Hsin-Chieh Yao"'
Autor:
Hsin-Chieh Yao, 姚欣潔
96
Unsuccessful clustering, as a result of different hybridization buffer used in a second set of samples, leads to repetitive experiments on the same samples using the original buffer. Thus, we have two sets of gene expression data for the same
Unsuccessful clustering, as a result of different hybridization buffer used in a second set of samples, leads to repetitive experiments on the same samples using the original buffer. Thus, we have two sets of gene expression data for the same
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/25032253315201979661
Autor:
Cao Min, Shau-Lin Shue, Yu-Sheng Wang, Hsin-Chieh Yao, Cheng-Hsiung Tsai, H. W. Tien, C. H. Huang, Jay Wu, Chung-Ju Lee
Publikováno v:
2017 IEEE International Interconnect Technology Conference (IITC).
The RC delay, electro migration (EM) and TDDB performance become more challenges to meet device requirement as continuous geometry shrink on BEOL dual damascene interconnects. To overcome these challenges from interconnect patterning point of view, w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7f13e34fa3a642f78b2fd40011a22bb
https://doi.org/10.1109/iitc-amc.2017.7968955
https://doi.org/10.1109/iitc-amc.2017.7968955
Autor:
Shau-Lin Shue, Chung-Ju Lee, Singh Sunil K, T. J. Tsai, Tien-I Bao, T. M. Huang, C.H. Yu, Y. S. Chang, C. W. Lu, Cheng-Hsiung Tsai, Hsin-Chieh Yao
Publikováno v:
2012 IEEE International Interconnect Technology Conference.
This study evaluated plasma treatment processes on 193i and EUV photoresist to improve the line width roughness (LWR) performance in porous low-k/ultra-thin barrier Cu interconnect. We successfully demonstrated 20% LWR reduction for 193i PR and 11% f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::165e1f3e2c5b334f1338581d1a448cc8
https://doi.org/10.1109/iitc.2012.6251569
https://doi.org/10.1109/iitc.2012.6251569