Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Hsien-Hsun Ou"'
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
The new high-density non-core package substrate needs to carry out the ultra-deep etching and thinning process of more than 20 microns when drawing the conductive graphics circuit and requires the smooth and uniform surface of the substrate after thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72230995d8965b9b2aa62d21396c9d05
https://doi.org/10.1109/icept50128.2020.9202558
https://doi.org/10.1109/icept50128.2020.9202558
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
As an important component of integrated circuit, package substrate is an essential intermediate product for electrical interconnection between chip and printed circuit board. The functions of package substrate are protect circuit board, dissipate hea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec0081d0241a3bd40905eddd2db3f635
https://doi.org/10.1109/icept50128.2020.9202412
https://doi.org/10.1109/icept50128.2020.9202412