Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Hsiao-Tung Ku"'
Autor:
Hsiao-Che Kuo, Ting-Yu Wang, Hao-Hsuan Hsu, Szu-Hsien Lee, Young-Mao Chen, Tieh-Jung Tsai, Ming-Chang Ou, Hsiao-Tung Ku, Gwo-Bin Lee, Tzong-Yueh Chen
Publikováno v:
PLoS ONE, Vol 7, Iss 8, p e42203 (2012)
Groupers of the Epinephelus spp. are an important aquaculture species of high economic value in the Asia Pacific region. They are susceptible to piscine nodavirus infection, which results in viral nervous necrosis disease. In this study, a rapid and
Externí odkaz:
https://doaj.org/article/85c7cc6b122540fd8a1eb336ae67abda
Autor:
Hsiao-Che Kuo, Ting-Yu Wang, Hao-Hsuan Hsu, Peng-Peng Chen, Szu-Hsien Lee, Young-Mao Chen, Tieh-Jung Tsai, Chien-Kai Wang, Hsiao-Tung Ku, Gwo-Bin Lee, Tzong-Yueh Chen
Publikováno v:
PLoS ONE, Vol 7, Iss 4, p e36183 (2012)
Infection of virus (such as nodavirus and iridovirus) and bacteria (such as Vibrio anguillarum) in farmed grouper has been widely reported and caused large economic losses to Taiwanese fish aquaculture industry since 1979. The multiplex assay was use
Externí odkaz:
https://doaj.org/article/ae641f0926824b6bb5c100ccca8e835b
Autor:
Hsiao-Tung Ku, 顧曉東
95
Recently, the integrated circuit trends to have more and more complex with multi-functions but smaller and smaller in size. For this reason, it needs much more exact calculation and desination for electrical characteristics. Poor design and p
Recently, the integrated circuit trends to have more and more complex with multi-functions but smaller and smaller in size. For this reason, it needs much more exact calculation and desination for electrical characteristics. Poor design and p
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/28031994899465126048
Autor:
Hsiao-Tung Ku, 顧曉東
90
The effect of thermal stress/strain distribution and the displacement of optical fiber in the optical fiber array module under cyclic thermal loading are investigated in this thesis. A general-purpose of finite element system ANSYS is adopted
The effect of thermal stress/strain distribution and the displacement of optical fiber in the optical fiber array module under cyclic thermal loading are investigated in this thesis. A general-purpose of finite element system ANSYS is adopted
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/90384190929755798448
Autor:
Kuo-Ning Chiang, Hsiao-Tung Ku
Publikováno v:
Microelectronics Reliability. 48:716-723
In this research, we showed that the different stress buffer configurations in the analog device will change the magnitude of the mechanical stress effect on the device surface, which will cause the variation in the output voltage characteristic of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02c836df6a3ed32a0c80689ed5e7bd79
https://doi.org/10.1016/j.microrel.2007.12.007
https://doi.org/10.1016/j.microrel.2007.12.007
Publikováno v:
Microelectronics Reliability. 47:196-204
As the industry keeps moving towards further miniaturization of electronic devices, even smaller sizes, a lower economical cost, and higher reliability are not only convenient but have become a necessity of the design. A well-designed package structu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b446e9720ea0b875c95fb9a90098bb7
https://doi.org/10.1016/j.microrel.2006.09.004
https://doi.org/10.1016/j.microrel.2006.09.004
Publikováno v:
Key Engineering Materials. :533-536
The predicted fatigue life of packaging structures using conventional procedures of finite element analysis (FEA) would be higher than an actual condition as a result of the perfect bonding interface assumed in the modeling. Actually, the crack exten
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::491b9015949d276b2d0a4f5254367bb0
https://doi.org/10.4028/www.scientific.net/kem.326-328.533
https://doi.org/10.4028/www.scientific.net/kem.326-328.533
Publikováno v:
Key Engineering Materials. :521-524
As the interconnection density of electronic packaging continues to increase, the fatigueinduced solder joint failure of surface mounted electronic devices become one of the most critical reliability issues in electronic packaging industry. Especiall
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8b9957e277dfc929729df2cd35a1d94
https://doi.org/10.4028/www.scientific.net/kem.326-328.521
https://doi.org/10.4028/www.scientific.net/kem.326-328.521
Autor:
Tieh Jung Tsai, Tzong-Yueh Chen, Hao Hsuan Hsu, Hsiao Che Kuo, Szu Hsien Lee, Ming Chang Ou, Young Mao Chen, Gwo-Bin Lee, Hsiao Tung Ku, Ting Yu Wang
Publikováno v:
PLoS ONE
PLoS ONE, Vol 7, Iss 8, p e42203 (2012)
PLoS ONE, Vol 7, Iss 8, p e42203 (2012)
Groupers of the Epinephelus spp. are an important aquaculture species of high economic value in the Asia Pacific region. They are susceptible to piscine nodavirus infection, which results in viral nervous necrosis disease. In this study, a rapid and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d2d5355fc823e3da3ffd374e51df2b0e
http://europepmc.org/articles/PMC3415436
http://europepmc.org/articles/PMC3415436