Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Hsiao Chin Tuan"'
Publikováno v:
Microelectronics Reliability. 61:125-128
A SOI platform is developed for a LDMOS transistor from 70 V to 300 V. It is one of the best cases covering the wide voltage range. By applying novel DTI technology, the pitch of a single LDMOS transistor cell is reduced. Thin silicon and oxide film
Publikováno v:
IEEE Transactions on Electron Devices. 60:3835-3841
In this paper, important parameters of the p-buried layer of a high-voltage reduced surface field p-n diode are analyzed and discussed in terms of effects on device performance, including breakdown voltage and specific turn-on resistance, Ron,sp. Gui
Autor:
Ruey-Hsin Liou, Hsueh-Liang Chou, Jeng Gong, Yu-Chang Jong, J. C. W. Ng, Chih-Fang Huang, Hsiao-Chin Tuan
Publikováno v:
IEEE Transactions on Electron Devices. 59:3042-3047
In this paper, it is the first time that the effect of self-heating of LDMOS transistors operating in the so-called expansion regime of the output characteristics is studied. Experimental characterization and numerical simulations are used to demonst
Autor:
Hsiao-Chin Tuan
Publikováno v:
VLSI-DAT
Internet of Things (IOT) has caught a lot of attention recently due to tremendous business opportunities. In this talk, the speaker intends to give the historical figures in PC/ NB and smartphones at first, and then bring in the overall view of IOT.
Autor:
Vikhram V. Swaminathan, Rashid Bashir, Bobby Reddy, Eric Salm, Hsiao Chin Tuan, Carlos Duarte-Guevara, Yi Shao Liu, Fei Lung Lai, Alex Kalnitsky, Ying Kit Tsui, Cheng Chun-Wen
Publikováno v:
Analytical chemistry. 86(16)
The adaptation of semiconductor technologies for biological applications may lead to a new era of inexpensive, sensitive, and portable diagnostics. At the core of these developing technologies is the ion-sensitive field-effect transistor (ISFET), a b
Autor:
Hsiao Chin Tuan, Chun-Wen Cheng, Chia-Hua Chu, Weileun Fang, Jiou-Kang Lee, Kai-Chih Liang, Alex Kalnitsky, David A. Horsley, Chung-Hsien Lin, Te-Hao Lee
Publikováno v:
2012 IEEE Sensors.
A MEMS process scheme designed for multi- sensors is presented. This new process scheme includes a poly bump not only provides stiction prevention and gap control function, and also electrical connection between MEMS structure and routing lines. Anot
Autor:
Tien-Kan Chung, Robert Chin-Fu Tsai, Nick Y. M. Shen, Sean Cheng, Emerson Cheng, Bruce C. S. Chou, Benior Chen, Kuei-Sung Chang, Yi-Shao Liu, Chung-Hsien Lin, CM Liu, Hsiao Chin Tuan, Alex Kalnitsky
Publikováno v:
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.
MEMS technology development and MEMS manufacturing activities at TSMC are presented. Two models for process development, i.e. customer product/process “phase-in” and internally developed “platform” are discussed. The latter is a TSMC-MEMS pla
Autor:
S. Filipiak, M. Foisy, John J. Hackenberg, Hsiao-chin Tuan, Xiang-Zheng Bo, Venkat R. Kolagunta, Konstantin V. Loiko, Li-te Lin, Jon Cheek, Paul A. Grudowski, D. Tekleab, Chi-hsi Wu, Vance H. Adams, K.h. Fung
Publikováno v:
2006 IEEE international SOI Conferencee Proceedings.
We report on the optimized transverse and lateral boundaries of dual etch stop layer (dESL) stressors in both PMOS and NMOS achieved in 65nm SOI transistors. We demonstrate that this gives an additional ~20% performance gain in ring oscillators. The
Autor:
C.H. Kung, I.-C. Liao, Hsiao-Chin Tuan, Kuo-Shu Tseng, M.W.D. Ken, Jyh-Jong Lin, Jinq-Min LIn
Publikováno v:
International Symposium on VLSI Technology, Systems and Applications.
A description is given of a high-performance 1-Mb CMOS mask ROM with access time as fast as 29 ns. The fast access is achieved through bit line capacitance reduction, sensitive amplifier design, and the use of double-metal interconnection. Delta-I no
Autor:
Liu, C.M., Chou, B.C.S., Tsai, R.C.-F., Shen, N.Y.M., Chen, B.S.F., Cheng, E.C.W., Hsiao Chin Tuan, Kalnitsky, A., Cheng, S., Chung-Hsien Lin, Tien-Kan Chung, Kuei-Sung Chang, Yi-Shao Liu
Publikováno v:
2011 16th International Solid-State Sensors, Actuators & Microsystems Conference (TRANSDUCERS); 2011, p807-810, 4p