Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Hsiang Han Hsu"'
Autor:
Matteo Manica, Jannis Born, Joris Cadow, Dimitrios Christofidellis, Ashish Dave, Dean Clarke, Yves Gaetan Nana Teukam, Giorgio Giannone, Samuel C. Hoffman, Matthew Buchan, Vijil Chenthamarakshan, Timothy Donovan, Hsiang Han Hsu, Federico Zipoli, Oliver Schilter, Akihiro Kishimoto, Lisa Hamada, Inkit Padhi, Karl Wehden, Lauren McHugh, Alexy Khrabrov, Payel Das, Seiji Takeda, John R. Smith
Publikováno v:
npj Computational Materials, Vol 9, Iss 1, Pp 1-6 (2023)
Abstract With the growing availability of data within various scientific domains, generative models hold enormous potential to accelerate scientific discovery. They harness powerful representations learned from datasets to speed up the formulation of
Externí odkaz:
https://doaj.org/article/d563c21247234f54b23d37c88d05e3d1
Autor:
Matteo Manica, Jannis Born, Joris Cadow, Dimitrios Christofidellis, Ashish Dave, Dean Clarke, Yves Gaetan Nana Teukam, Giorgio Giannone, Samuel C. Hoffman, Matthew Buchan, Vijil Chenthamarakshan, Timothy Donovan, Hsiang Han Hsu, Federico Zipoli, Oliver Schilter, Akihiro Kishimoto, Lisa Hamada, Inkit Padhi, Karl Wehden, Lauren McHugh, Alexy Khrabrov, Payel Das, Seiji Takeda, John R. Smith
With the growing availability of data within various scientific domains, generative models hold enormous potential to accelerate scientific discovery. They harness powerful representations learned from datasets to speed up the formulation of novel hy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::145b068669f6e0ef69f5e03844536585
Publikováno v:
CLOUD
The complexity of building, deploying, and managing cross-organizational enterprise computing services with self-service, security, and quality assurances has been increasing exponentially in the era of hybrid multiclouds. AI-accelerated material dis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0bef10803771a6541c83995b0bfef983
https://doi.org/10.1109/cloud49709.2020.00051
https://doi.org/10.1109/cloud49709.2020.00051
Autor:
Katsuhiko Hino, Wolf Bocanett, Seiji Takeda, Yasumitsu Orii, Yuta Tsuchiya, Makoto Kogoh, Hsiang-Han Hsu, Kentaro Yano, Toshiyuki Hama, Yenwei Cheng, Daiju Nakano, Daniel P. Sanders, Takumi Hongo, Akihiro Fujita, Dmitry Yu. Zubarev, Hideaki Nakashika, Hiroki Toda, Victoria A. Piunova, Shuichi Hirose, Jed W. Pitera
Publikováno v:
KDD
The discovery of new materials has been the essential force which brings a discontinuous improvement to industrial products' performance. However, the extra-vast combinatorial design space of material structures exceeds human experts' capability to e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4ab4d4786e570322d2daf6ac4e026a16
http://arxiv.org/abs/2004.11521
http://arxiv.org/abs/2004.11521
Autor:
Alexander Janta-Polczynski, Paul Fortier, Koji Masuda, Hsiang-Han Hsu, Richard Langlois, Masao Tokunari, Jacques Patrick, Elaine Cyr
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A polymer lens attach process is developed on Optical Multi-Chip Modules (OMCM) with integrated optical waveguides and tested successfully in Deep Thermal Cycle (DTC) at -40°C/125°C for 1000 cycles. The lens attach is completed in a two step proces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9fbef6d3cea193a9c737af68818afb8b
https://doi.org/10.1109/ectc.2019.00168
https://doi.org/10.1109/ectc.2019.00168
Autor:
Richard Langlois, Masao Tokunari, Hsiang-Han Hsu, Koji Masuda, Jacques Patrick, Paul Fortier, Takashi Hisada, Shigeru Nakagawa
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Assembly process reliability for Optical Multi-Chip Modules (MCM) is studied and improved. In the optoelectronic (OE) chip assembly for the Optical MCM, the OE chip with Au stud bump is joined with Sn-Ag-Cu (SAC) soldered in a through-waveguide via o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe63bbe0598ea33821849607965cefc1
https://doi.org/10.1109/ectc.2017.204
https://doi.org/10.1109/ectc.2017.204
Publikováno v:
Journal of Lightwave Technology. 32:1207-1212
A high-bandwidth density and low-power optical multichip module (MCM) is developed and demonstrated. The module includes bare optical and driver chips and an application specific integrated circuit bonded on an optical waveguide-integrated organic ca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b686838cd2f7e2495287829292d46cb
https://doi.org/10.1109/jlt.2013.2292703
https://doi.org/10.1109/jlt.2013.2292703
Publikováno v:
Journal of Lightwave Technology. 31:2036-2042
The connection loss which occurs when light transfers from one medium to another attracts additional attention in high-speed and low-power optical links. In this paper, we not only experimentally apply graded index polymer optical waveguide (GI-POW)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8fa8dd7f028cc7e01fb50f0eeb641079
https://doi.org/10.1109/jlt.2013.2262711
https://doi.org/10.1109/jlt.2013.2262711
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
For efficient light coupling from and into an optical multi-chip module (MCM), the micro-lens array connector (MLAC) is developed. MLAC, composed of a waveguide side lens array and a fiber side connector, integrates 24 collimation micro-lense pairs i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0bd43e326ccd4a8a5b92842e69007946
https://doi.org/10.1109/ectc.2016.307
https://doi.org/10.1109/ectc.2016.307
Publikováno v:
2015 IEEE CPMT Symposium Japan (ICSJ).
Organic optical multi-chip modules for high bandwidth-density and low-power link in high-performance computing systems are developed. The light from polymer optical waveguide is coupled to a multimode fiber through a total internal reflection (TIR) m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c06f8b23a19ac113eb57be4efd642ca
https://doi.org/10.1109/icsj.2015.7357387
https://doi.org/10.1109/icsj.2015.7357387