Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Hsi-chang Hsu"'
Autor:
Hsi-Chang Hsu, 許錫昌
96
In the personal computer increasingly common today, the computer has become an integral part of human life necessities. Personal computers are motherboards by carrying a combination of various components, so the quality of the motherboards wi
In the personal computer increasingly common today, the computer has become an integral part of human life necessities. Personal computers are motherboards by carrying a combination of various components, so the quality of the motherboards wi
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/82708478821842438899
Autor:
George Pan, James Jiang, Jay Hsiao, Hsi-chang Hsu, Nicholas Kao, Andrew You, Soriente Joshua Pagala, Ivan Chang, Kenny Liu, Carter Ding, Tammy Zhu, Cheng-An Chang, Tommy Sun, Hong-Da Chang, Jase Jiang
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Portable electronic products have been extended for high performance and high-density silicon node applications in recent years. In order to meet customer increased expectations regarding functionality, size, power dissipation, thermal performance an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06ad2ddb7c7162396b1b39dc6a5113cd
https://doi.org/10.1109/eptc.2016.7861493
https://doi.org/10.1109/eptc.2016.7861493
Autor:
Rui-Feng Tai, Chang-Lun Lu, Kenny Liu, Steve Chiu, Hsiao-Chun Huang, Chun-Tang Lin, Hsi-chang Hsu, David Chang, Hong-Da Chang, Yi-Che Lai
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Wafer Level Packaging (WLP) is a packaging technology focusing on integrated circuit (IC) packaging at wafer level instead of die level. WLP essentially consists of IC foundry fabrication process and subsequent device interconnection and back-end pas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08500fc46f004470ba31b35c3316b9e3
https://doi.org/10.1109/ectc.2014.6897402
https://doi.org/10.1109/ectc.2014.6897402