Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Howard Leo Kalter"'
Publikováno v:
IEEE Journal of Solid-State Circuits. 33:1731-1740
A built-in self-test engine and test methodology have been developed for testing a family of high-bandwidth, high-density DRAM macros. The DRAM macros range in size from 256/spl times/16/spl times/128 to 2 K/spl times/16/spl times/256 (Word/spl times
Autor:
Erik L. Hedberg, Christopher P. Miller, Anatol Furman, Wayne F. Ellis, Jeffrey H. Dreibelbis, H. S. Lee, Thomas M. Maffitt, John E. Barth, C.H. Stapper, Howard Leo Kalter, Sridhar Divakaruni
Publikováno v:
IBM Journal of Research and Development. 39:51-62
Autor:
Scott C. Lewis, James Andrew Yankosky, Charles Edward Drake, J. Dilorenzo, W.B. van der Hoeven, Gordon Arthur Kelley, John A. Fifield, C.H. Stapper, John E. Barth, Howard Leo Kalter
Publikováno v:
IEEE Journal of Solid-State Circuits. 25:1118-1128
A high-speed 16-Mb DRAM chip with on-chip error-correcting code (ECC), which supports either 11/11 or 12/0 RAS/CAS addressing and operates on a 3.3- or 5-V power supply, is described. It can be packaged as a 2-Mb*8, 4-Mb*4, 8-Mb*2, or 16-Mb*1 DRAM, A
Publikováno v:
Annual Reliability and Maintainability Symposium 1993 Proceedings.
The number of transistors on integrated-circuit chips is growing exponentially. This makes it increasingly difficult to satisfy the continuing demand for ever higher reliability of chips. The tools available to the chip architects and circuit designe
Publikováno v:
Annual Reliability and Maintainability Symposium. 1991 Proceedings.
A combination of redundant circuits and error-correcting-code circuits have been implemented on a 16 Mb memory chip. The combination of these circuits results in a synergistic fault-tolerance scheme, making this chip immune to a high level of manufac
Autor:
Scott C. Lewis, William Paul Hovis, John E. Barth, John A. Fifield, Charles Edward Drake, J. Dilorenzo, J. Nickel, C.H. Stapper, Howard Leo Kalter, James Andrew Yankosky, Gordon Arthur Kelley
Publikováno v:
1990 37th IEEE International Conference on Solid-State Circuits.
A 16-Mb DRAM chip fabricated in a 0.5- mu m CMOS process using silicided polysilicon, double metal, and trench storage is described. It incorporates an architecture that supports either 11/11 or 12/10 RAS/CAS (row-address strobe/column-address-strobe
Autor:
T. Leasure, J.M. Poplawski, John A. Fifield, C. Patton, P.D. Coppens, S.W. Tomashot, R. Papritz, Howard Leo Kalter, Christopher P. Miller, W.F. Ellis, W.B. van der Hoeven, D.J. Kokoszka, Q. Nguyen
Publikováno v:
IEEE Journal of Solid-State Circuits. 20:914-923
An experimental general purpose 5-V 1-Mb dynamic RAM has been designed for increased performance, high density, and enhanced reliability. The array consists of a one-device overlapped I/O cell with a metal bitline architecture. The cell measures 4.1