Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Howard L. Heck"'
Publikováno v:
ISCAS
This paper presents an encoding variation on the Crosstalk-Harnessed Signaling (CHS) technique, aimed towards eliminating the common-mode eigenvector included in the Hadamard matrix for CHS encoding/decoding. This is accomplished by either removing t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b46f0671cdacc7f869696c1f5009efe
https://doi.org/10.1109/iscas51556.2021.9401463
https://doi.org/10.1109/iscas51556.2021.9401463
Publikováno v:
IEEE Transactions on Computers. :1-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4852ec0a813bea1d23375233895fc50
https://doi.org/10.1109/tc.2021.3120242
https://doi.org/10.1109/tc.2021.3120242
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
A novel and patent-pending [1] routing configuration to address the multi-reflection noise caused by the vertical interconnect viz. plated-through-hole (PTH) is presented in this paper. The PTHs are frequently found in any packaging and printed circu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ee9a8f317d2da6fd7dd03ecb835f29a
https://doi.org/10.1109/eptc.2017.8277440
https://doi.org/10.1109/eptc.2017.8277440
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
This work describes an innovative low-loss transmission line routing configuration, which enables improved channel margin in next-generation high-speed serial buses beyond 10Gbps applications. One such example is SuperSpeed Plus USB a.k.a. USB 3.1 Ge
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1bf3147de95348d306177b1f7ed27e1b
https://doi.org/10.1109/eptc.2016.7861534
https://doi.org/10.1109/eptc.2016.7861534
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 54:1983-1990
This paper reports an experimental and computational study of substrate integrated waveguides (SIWs) optimized for use as ultrahigh-speed bandpass waveguiding digital interconnects. The novelty of this study resides in our successful design, fabricat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3af2d4b0bcd922c055f8022e734b19a2
https://doi.org/10.1109/tmtt.2006.873622
https://doi.org/10.1109/tmtt.2006.873622
Publikováno v:
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems.
This paper demonstrates the modeling methodology of the transmitter compliance test and the full link test which is used to develop the 10Gbps USB3.1 compliance specification and the reference equalization.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aac4a0088b10e326b162720d05c93ac9
https://doi.org/10.1109/epeps.2014.7103625
https://doi.org/10.1109/epeps.2014.7103625
Publikováno v:
IEEE Microwave and Wireless Components Letters. 14:343-345
As clock rates continue to rise, problems with signal integrity, cross-coupling, and radiation may render impractical the baseband metallic interconnects presently used in computers. A potential means to address this problem is to use bandpass wirele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90ffe62908c30f505e306f51683f1bfc
https://doi.org/10.1109/lmwc.2004.829283
https://doi.org/10.1109/lmwc.2004.829283
Publikováno v:
2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.
This paper presents an interleaved routing method for motherboard microstrip routing in Multi-Gbps interfaces. The proposed method yields improved channel performance in terms of Eye Height(mV) and Eye Width(ps) margins. Of note is the more prominent
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::759ad30ab2b88901faeed1f2c17cbcfa
https://doi.org/10.1109/epeps.2012.6457901
https://doi.org/10.1109/epeps.2012.6457901
Autor:
Howard L. Heck, Zachi Baharav, Taechan Kim, Anthony Vetro, David Helster, Scott A. Snyder, Jim Nadolny
Publikováno v:
2012 IEEE 16th International Symposium on Consumer Electronics.
Title: “A Day Made of Glass” — A vision for an enabled future: challenges and opportunities Presenter/Title: Zachi Baharav, Ph.D. (Researcher, Corning West Technology Center, Corning Incorporated) Coming's “A Day Made of Glass” video was po
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ecce8c9d59bbb8f5ac7b35ffe7e4bd9e
https://doi.org/10.1109/isce.2012.6241701
https://doi.org/10.1109/isce.2012.6241701
Autor:
Stephen H. Hall, Howard L. Heck
Publikováno v:
Advanced Signal Integrity for High-Speed Digital Designs ISBN: 9780470423899
Advanced Signal Integrity for High-Speed Digital Designs
Advanced Signal Integrity for High-Speed Digital Designs
This chapter contains sections titled: Eye Diagram Bit Error Rate Jitter Sources and Budgets Noise Sources and Budgets Peak Distortion Analysis Methods Summary References Problems
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64b3f19b7debd9040f76f772c05f430b
https://doi.org/10.1002/9780470423899.ch13
https://doi.org/10.1002/9780470423899.ch13
