Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Houfei Chen"'
Publikováno v:
IEEE Electromagnetic Compatibility Magazine. 8:54-56
High-speed DDR3 and DDR4 memory requires tight length matching between clock and data traces so that signal timing parameters can be met. In this paper, we look at the length matching between clock and command/address/control (CAC) on daisychained si
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2fbd1655007b1cdb4171410c17209d07
https://doi.org/10.1109/memc.2019.8753443
https://doi.org/10.1109/memc.2019.8753443
Publikováno v:
2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278); 2002, p983-986, 4p
Publikováno v:
Microwave and Optical Technology Letters. 39:290-295
A method for full-wave modeling of the exterior structure of vertical via, which considers the actual layout of an exterior structure with pad and vertical bent into the via, is presented. This method is more accurate than simple coaxial cable feed-i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ef1a07f227c54082a17fe77f8f286d3
https://doi.org/10.1002/mop.11194
https://doi.org/10.1002/mop.11194
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 51:818-829
A method is presented for full-wave modeling of vertical vias in multilayered circuits. The analysis of the interior problem is based upon the cylindrical wave expansion of the magnetic field Green's function. The multiple interaction among vertical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de970f973e0429aed2d787834e825f19
https://doi.org/10.1109/tmtt.2003.808616
https://doi.org/10.1109/tmtt.2003.808616
Publikováno v:
Microwave and Optical Technology Letters. 35:34-40
The problem of a single-layered via through two parallel ground planes is studied. The problem is decomposed into the exterior problem and the interior problem. For each problem, the quasi-static solution, the full-wave solution, and the low-frequenc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::17218994be83f66692302fae866cc229
https://doi.org/10.1002/mop.10508
https://doi.org/10.1002/mop.10508
Publikováno v:
Microwave and Optical Technology Letters. 31:201-208
The full-wave solution of multiple scattering among cylindrical vias in planar waveguides is modeled by using Foldy–Lax equations. By using the equivalence principle, the coupling among traces with many vias is decomposed into interior and exterior
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9660b6b687d77a16aba38ff74bdee949
https://doi.org/10.1002/mop.1398
https://doi.org/10.1002/mop.1398
Publikováno v:
IEEE Antennas and Propagation Society Symposium, 2004..
We present a full wave solver for coupled microstrip lines and multiple vias on printed circuit boards. The formulation is broken down into the interior problem and the exterior problem. The interior problem solves the scattering from a large number
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8c03e82fd2351c743391f10c411e60d
https://doi.org/10.1109/aps.2004.1332086
https://doi.org/10.1109/aps.2004.1332086
Publikováno v:
2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).
A method is presented for modeling the multi-interaction among large numbers of vertical vias in densely packaged integrated circuits. The analysis of the interior problem is based upon a cylindrical wave expansion of the magnetic field Green's funct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::336e73e3a11f23af22d44b86cdae98b4
https://doi.org/10.1109/mwsym.2002.1011794
https://doi.org/10.1109/mwsym.2002.1011794
Publikováno v:
IEEE Transactions on Microwave Theory & Techniques; Mar2003, Vol. 51 Issue 3, p818, 12p, 5 Diagrams, 10 Graphs
Publikováno v:
IEE Proceedings - Microwaves, Antennas and Propagation. 148:167
A microstrip with gap discontinuity and bypass capacitors on the ground plane for interconnects in multilayered digital circuits is analysed. The approach is based on integral equations using the spatial-domain magnetic field Green's function in a la
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b93d1a77a1a7de242a8ead8fa012647f
https://doi.org/10.1049/ip-map:20010491
https://doi.org/10.1049/ip-map:20010491