Zobrazeno 1 - 10
of 172
pro vyhledávání: '"Hou-Jun Hsu"'
Autor:
Hou-Jun Hsu, 許后竣
98
With the electronics industry advancing rapidly toward faster, smaller, lighter, and cheaper products, flip-chip packaging has been extensively used in microelectronics industries. To obtain a reliable interconnection of the flip-chip, it is
With the electronics industry advancing rapidly toward faster, smaller, lighter, and cheaper products, flip-chip packaging has been extensively used in microelectronics industries. To obtain a reliable interconnection of the flip-chip, it is
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/99pqah
Autor:
Hou-Jun Hsu, 許后竣
93
The micro-electroplating process is the only method that can fabricate metallic micro-structures speedy in the LIGA/MEMS technology. This kind of deposition method is characterized by manufacturing high aspect ratio and complex 3D structures
The micro-electroplating process is the only method that can fabricate metallic micro-structures speedy in the LIGA/MEMS technology. This kind of deposition method is characterized by manufacturing high aspect ratio and complex 3D structures
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/32zemv
Publikováno v:
Microelectronic Engineering. 113:147-151
This study designs a CMOS-MEMS probe chip and fabricates it using the [email protected] CMOS process of the Taiwan Semiconductor Manufacturing Company (TSMC). The post-CMOS procedure is a Micro-electromechanical system (MEMS) technology that involves
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a2f23e1e9abfcbf692c90c1d0ba14c2
https://doi.org/10.1016/j.mee.2013.07.023
https://doi.org/10.1016/j.mee.2013.07.023
Publikováno v:
Sensors and Actuators A: Physical. 160:22-28
In response to the essential role probe cards play in the semiconductor testing industry, a CMOS-MEMS force sensing devices capable of simultaneously monitoring the probe reacting force and electrical test signals is designed for probe cards. The pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c612f88ed18f5a229aead550d1bd24b
https://doi.org/10.1016/j.sna.2010.02.027
https://doi.org/10.1016/j.sna.2010.02.027
Publikováno v:
Microelectronic Engineering. 85:1590-1596
Thus far, no any effective countermeasure against plating-induced poor uniformity exists in the global packaging market. In this paper, we aim to develop an effective polishing process to improve the poor uniformity existing in advanced double-layer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b39d27d86a7e12401b3548e21afaa3f2
https://doi.org/10.1016/j.mee.2008.03.005
https://doi.org/10.1016/j.mee.2008.03.005
Publikováno v:
Materials Science in Semiconductor Processing. 10:133-142
Electroplating is the best process for the manufacture of fine pitch flip chip solder bumps. However, certain unstable electroplating parameters usually cause poorer coplanarity, which affects packaging reliability and yield. This paper attempts to u
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f2ae3197c752a9423ab5170f77fe30d
https://doi.org/10.1016/j.mssp.2007.07.001
https://doi.org/10.1016/j.mssp.2007.07.001
Publikováno v:
Microelectronic Engineering. 84:60-71
This paper presents an innovative polishing process aimed at leveling rough surface of plating-based flip chip solder bumps so as to get uniform coplanarity across the whole substrate after both electroplating and reflow processes. This polishing mec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::450d3e176a0e9726eeb6dcad7d810089
https://doi.org/10.1016/j.mee.2006.08.005
https://doi.org/10.1016/j.mee.2006.08.005
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In recent years, as mobile equipment such as cellular phones and PDAs become drastically higher performance and downsized, semiconductor devices are rapidly becoming more integrated and higher speed. As a result of high integration, the pitches of el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f1d0179a06385e1e873e08c23ba5757
https://doi.org/10.1109/impact.2012.6420275
https://doi.org/10.1109/impact.2012.6420275
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Recently, there are many researches on the design of RF probes. Usually the materials of RF probe are tungsten and copper beryllium. They employed fabrication process of soldering and drawing of metal wire, which are not compatible with MEMS or IC fa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7cc84b5812558c16b101d303ae54abd
https://doi.org/10.1109/impact.2012.6420276
https://doi.org/10.1109/impact.2012.6420276