Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Hoskins BD"'
Autor:
Zhao J; Department of Computer Science, George Washington University, Washington, DC, United States., Huang S; Department of Computer Science, George Washington University, Washington, DC, United States., Yousuf O; Department of Electrical and Computer Engineering, George Washington University, Washington, DC, United States., Gao Y; Department of Computer Science, George Washington University, Washington, DC, United States., Hoskins BD; Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, United States., Adam GC; Department of Electrical and Computer Engineering, George Washington University, Washington, DC, United States.
Publikováno v:
Frontiers in neuroscience [Front Neurosci] 2021 Nov 22; Vol. 15, pp. 749811. Date of Electronic Publication: 2021 Nov 22 (Print Publication: 2021).
Autor:
Berggren K; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, United States of America., Xia Q; Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA, United States of America., Likharev KK; Stony Brook University, Stony Brook, NY 11794, Unites States., Strukov DB; Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA 93106, United States of America., Jiang H; School of Engineering & Applied Science Yale University, CT, United States of America., Mikolajick T; NaMLab gGmbH and TU Dresden, Germany., Querlioz D; Université Paris-Saclay, CNRS, France., Salinga M; Institut für Materialphysik, Westfälische Wilhelms-Universität Münster, Germany., Erickson JR; Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA 15261, United States of America., Pi S; Lam Research, Fremont, CA, United States of America., Xiong F; Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA 15261, United States of America., Lin P; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, United States of America., Li C; Department of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong SAR, China., Chen Y; School of information science and technology, Fudan University, Shanghai, People's Republic of China., Xiong S; School of information science and technology, Fudan University, Shanghai, People's Republic of China., Hoskins BD; Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, United States of America., Daniels MW; Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, United States of America., Madhavan A; Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, United States of America.; Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, MD, United States of America., Liddle JA; Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, United States of America., McClelland JJ; Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, United States of America., Yang Y; School of Electronics Engineering and Computer Science, Peking University, Beijing, People's Republic of China., Rupp J; Department of Materials Science and Engineering and Department of Electrical Engineering & Computer Science, Massachusetts Institute of Technology, Cambridge, MA 02139, United States of America.; Electrochemical Materials, ETHZ Department of Materials, Hönggerbergring 64, Zürich 8093, Switzerland., Nonnenmann SS; Department of Mechanical & Industrial Engineering, University of Massachusetts-Amherst, MA, United States of America., Cheng KT; School of Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, People's Republic of China., Gong N; IBM T J Watson Research Center, Yorktown Heights, NY 10598, United States of America., Lastras-Montaño MA; Instituto de Investigación en Comunicación Óptica, Facultad de Ciencias, Universidad Autónoma de San Luis Potosí, México., Talin AA; Sandia National Laboratories, Livermore, CA 94551, United States of America., Salleo A; Department of Materials Science and Engineering, Stanford University, Stanford, California, United States of America., Shastri BJ; Department of Physics, Engineering Physics & Astronomy, Queen's University, Kingston ON KL7 3N6, Canada., de Lima TF; Department of Electrical Engineering, Princeton University, Princeton, NJ 08544, United States of America., Prucnal P; Department of Electrical Engineering, Princeton University, Princeton, NJ 08544, United States of America., Tait AN; Physical Measurement Laboratory, National Institute of Standards and Technology (NIST), Boulder, CO 80305, United States of America., Shen Y; Lightelligence, 268 Summer Street, Boston, MA 02210, United States of America., Meng H; Lightelligence, 268 Summer Street, Boston, MA 02210, United States of America., Roques-Carmes C; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, United States of America., Cheng Z; Department of Materials, University of Oxford, Oxford OX1 3PH, United Kingdom.; State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, People's Republic of China., Bhaskaran H; Department of Materials, University of Oxford, Oxford OX1 3PH, United Kingdom., Jariwala D; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia PA 19104, United States of America., Wang H; University of Southern California, Los Angeles, CA 90089, United States of America., Shainline JM; Physical Measurement Laboratory, National Institute of Standards and Technology (NIST), Boulder, CO 80305, United States of America., Segall K; Department of Physics and Astronomy, Colgate University, NY 13346, United States of America., Yang JJ; Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA, United States of America., Roy K; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907, United States of America., Datta S; University of Notre Dame, Notre Dame, IN 46556, United States of America., Raychowdhury A; Georgia Institute of Technology, Atlanta, GA 30332, United States of America.
Publikováno v:
Nanotechnology [Nanotechnology] 2021 Jan 01; Vol. 32 (1), pp. 012002.
Autor:
Zaslavsky A; School of Engineering, Brown University, Providence, Rhode Island 02912, USA.; Nanoscale Device Characterization Division, Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA., Richter CA; Nanoscale Device Characterization Division, Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA., Shrestha PR; Nanoscale Device Characterization Division, Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA.; Theiss Research, La Jolla, California 92037, USA., Hoskins BD; Nanoscale Device Characterization Division, Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA., Le ST; Nanoscale Device Characterization Division, Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA.; Theiss Research, La Jolla, California 92037, USA., Madhavan A; Nanoscale Device Characterization Division, Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA.; University of Maryland, College Park, Maryland 20742, USA., McClelland JJ; Nanoscale Device Characterization Division, Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA.
Publikováno v:
Applied physics letters [Appl Phys Lett] 2021; Vol. 119 (4).
Autor:
Budhathoki S; Department of Physics and Astronomy, University of Alabama, Tuscaloosa AL 35487, U.S.A., Sapkota A; Department of Physics and Astronomy, University of Alabama, Tuscaloosa AL 35487, U.S.A., Law KM; Department of Physics and Astronomy, University of Alabama, Tuscaloosa AL 35487, U.S.A., Ranjit S; Department of Physics and Astronomy, University of Alabama, Tuscaloosa AL 35487, U.S.A., Nepal B; Department of Physics and Astronomy, University of Alabama, Tuscaloosa AL 35487, U.S.A., Hoskins BD; Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, U.S.A., Thind AS; Institute of Materials Science Engineering, Washington University in St. Louis, One Brookings Drive, St. Louis, MO 63130, U.S.A., Borisevich AY; Center for Nanophase Materials Sciences, Oak Ridge National Laboratory, Oak Ridge, TN 37831, U.S.A., Jamer ME; Physics Department, United States Naval Academy, Annapolis, MD 21402, U.S.A., Anderson TJ; Naval Research Laboratory, Washington, DC 20375, U.S.A., Koehler AD; Naval Research Laboratory, Washington, DC 20375, U.S.A., Hobart KD; Naval Research Laboratory, Washington, DC 20375, U.S.A., Stephen GM; Physics Department, Northeastern University, Boston, MA 02115, U.S.A., Heiman D; Physics Department, Northeastern University, Boston, MA 02115, U.S.A., Mewes T; Department of Physics and Astronomy, University of Alabama, Tuscaloosa AL 35487, U.S.A., Mishra R; Institute of Materials Science Engineering, Washington University in St. Louis, One Brookings Drive, St. Louis, MO 63130, U.S.A.; Department of Mechanical Engineering Materials Science, Washington University in St. Louis, One Brookings Drive, St. Louis, MO 63130, U.S.A., Gallagher JC; U.S. Naval Research Laboratory, Washington, DC 20375, U.S.A., Hauser AJ; Department of Physics and Astronomy, University of Alabama, Tuscaloosa AL 35487, U.S.A.
Publikováno v:
Physical review. B [Phys Rev B] 2020 Jun; Vol. 101 (22).
Autor:
Strelcov E; Physical Measurement Laboratory , National Institute of Standards and Technology , Gaithersburg , Maryland 20899 , United States.; Maryland NanoCenter , University of Maryland , College Park , Maryland 20742 , United States., Arble C; Physical Measurement Laboratory , National Institute of Standards and Technology , Gaithersburg , Maryland 20899 , United States., Guo H; SEU-FEI Nano-Pico Center, Key Laboratory of MEMS of Ministry of Education , Southeast University , Nanjing 210096 , China., Hoskins BD; Physical Measurement Laboratory , National Institute of Standards and Technology , Gaithersburg , Maryland 20899 , United States., Yulaev A; Physical Measurement Laboratory , National Institute of Standards and Technology , Gaithersburg , Maryland 20899 , United States.; Department of Chemistry and Biochemistry , University of Maryland , College Park , Maryland 20742 , United States., Vlassiouk IV; Oak Ridge National Laboratory , Oak Ridge , Tennessee 37830 , United States., Zhitenev NB; Physical Measurement Laboratory , National Institute of Standards and Technology , Gaithersburg , Maryland 20899 , United States., Tselev A; Department of Physics and CICECO-Aveiro Institute of Materials , University of Aveiro , 3810-193 Aveiro , Portugal., Kolmakov A; Physical Measurement Laboratory , National Institute of Standards and Technology , Gaithersburg , Maryland 20899 , United States.
Publikováno v:
Nano letters [Nano Lett] 2020 Feb 12; Vol. 20 (2), pp. 1336-1344. Date of Electronic Publication: 2020 Jan 31.
Autor:
Hoskins BD; Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, United States., Daniels MW; Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, United States., Huang S; Electrical and Computer Engineering, George Washington University, Washington, DC, United States., Madhavan A; Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, United States.; Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, MD, United States., Adam GC; Electrical and Computer Engineering, George Washington University, Washington, DC, United States., Zhitenev N; Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, United States., McClelland JJ; Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, United States., Stiles MD; Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, United States.
Publikováno v:
Frontiers in neuroscience [Front Neurosci] 2019 Aug 06; Vol. 13, pp. 793. Date of Electronic Publication: 2019 Aug 06 (Print Publication: 2019).
Autor:
Goodwill JM; Department of Materials Science and Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, 15213, USA.; Nanoscale Device Characterization Division, Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA., Ramer G; Nanoscale Device Characterization Division, Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA., Li D; Department of Materials Science and Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, 15213, USA.; Nanoscale Device Characterization Division, Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA., Hoskins BD; Nanoscale Device Characterization Division, Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA., Pavlidis G; Nanoscale Device Characterization Division, Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA., McClelland JJ; Nanoscale Device Characterization Division, Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA., Centrone A; Nanoscale Device Characterization Division, Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA., Bain JA; Department of Electrical and Computer Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, 15213, USA., Skowronski M; Department of Materials Science and Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh, PA, 15213, USA. mareks@cmu.edu.
Publikováno v:
Nature communications [Nat Commun] 2019 Apr 09; Vol. 10 (1), pp. 1628. Date of Electronic Publication: 2019 Apr 09.
Autor:
Hoskins BD; Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA. brian.hoskins@nist.gov.; Materials Department, University of California Santa Barbara, Santa Barbara, CA, 93106, USA. brian.hoskins@nist.gov., Adam GC; Electrical and Computer Engineering Department, University of California Santa Barbara, Santa Barbara, CA, 93106, USA.; Institute for Research and Development in Microtechnologies, 077190, Bucharest, Romania., Strelcov E; Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA.; Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, MD, 20742, USA., Zhitenev N; Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA., Kolmakov A; Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA., Strukov DB; Electrical and Computer Engineering Department, University of California Santa Barbara, Santa Barbara, CA, 93106, USA., McClelland JJ; Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA.
Publikováno v:
Nature communications [Nat Commun] 2018 Jan 24; Vol. 9 (1), pp. 413. Date of Electronic Publication: 2018 Jan 24.
Autor:
Liddle JA; National Institute of Standards and Technology, Gaithersburg, Maryland, 20899, USA., Hoskins BD; National Institute of Standards and Technology, Gaithersburg, Maryland, 20899, USA., Vladár AE; National Institute of Standards and Technology, Gaithersburg, Maryland, 20899, USA., Villarrubia JS; National Institute of Standards and Technology, Gaithersburg, Maryland, 20899, USA.
Publikováno v:
APL materials [APL Mater] 2018; Vol. 6.
Autor:
Hoskins BD; Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA. brian.hoskins@nist.gov.; Materials Department, University of California Santa Barbara, Santa Barbara, CA, 93106, USA. brian.hoskins@nist.gov., Adam GC; Electrical and Computer Engineering Department, University of California Santa Barbara, Santa Barbara, CA, 93106, USA.; Institute for Research and Development in Microtechnologies, 077190, Bucharest, Romania., Strelcov E; Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA.; Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, MD, 20742, USA., Zhitenev N; Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA., Kolmakov A; Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA., Strukov DB; Electrical and Computer Engineering Department, University of California Santa Barbara, Santa Barbara, CA, 93106, USA., McClelland JJ; Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA.
Publikováno v:
Nature communications [Nat Commun] 2017 Dec 07; Vol. 8 (1), pp. 1972. Date of Electronic Publication: 2017 Dec 07.