Zobrazeno 1 - 10
of 49
pro vyhledávání: '"Horwath JP"'
Autor:
Horwath JP; Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA. jhorwath@anl.gov., Lin XM; Center for Nanoscale Materials, Argonne National Laboratory, Lemont, IL, USA., He H; Materials Science Division and Center for Molecular Engineering, Argonne National Laboratory, Lemont, IL, USA.; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA., Zhang Q; Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA., Dufresne EM; Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA., Chu M; Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA., Sankaranarayanan SKRS; Center for Nanoscale Materials, Argonne National Laboratory, Lemont, IL, USA.; Department of Mechanical and Industrial Engineering, University of Illinois, Chicago, IL, USA., Chen W; Materials Science Division and Center for Molecular Engineering, Argonne National Laboratory, Lemont, IL, USA.; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA., Narayanan S; Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA. sureshn@anl.gov., Cherukara MJ; Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA. mcherukara@anl.gov.
Publikováno v:
Nature communications [Nat Commun] 2024 Sep 09; Vol. 15 (1), pp. 7867. Date of Electronic Publication: 2024 Sep 09.
Autor:
Horwath JP; Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA. jhorwath@anl.gov., Lin XM; Center for Nanoscale Materials, Argonne National Laboratory, Lemont, IL, USA., He H; Materials Science Division and Center for Molecular Engineering, Argonne National Laboratory, Lemont, IL, USA.; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA., Zhang Q; Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA., Dufresne EM; Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA., Chu M; Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA., Sankaranarayanan SKRS; Center for Nanoscale Materials, Argonne National Laboratory, Lemont, IL, USA.; Department of Mechanical and Industrial Engineering, University of Illinois, Chicago, IL, USA., Chen W; Materials Science Division and Center for Molecular Engineering, Argonne National Laboratory, Lemont, IL, USA.; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA., Narayanan S; Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA. sureshn@anl.gov., Cherukara MJ; Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA. mcherukara@anl.gov.
Publikováno v:
Nature communications [Nat Commun] 2024 Jul 15; Vol. 15 (1), pp. 5945. Date of Electronic Publication: 2024 Jul 15.
Autor:
Kumar P; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Inter-university Microelectronics Center (IMEC), Leuven 3001, Belgium., Chen J; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Meng AC; Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Department of Physics and Astronomy, University of Missouri, Columbia, Missouri 65211, United States., Yang WD; National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States., Anantharaman SB; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Low-dimensional Semiconductors Lab, Metallurgical and Materials Engineering, Indian Institute of Technology-Madras, Chennai, Tamilnadu 600036, India., Horwath JP; Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.; Argonne National Laboratory, Lemont, Illinois 60439, United States., Idrobo JC; Center for Nanophase Materials Sciences, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37830, United States.; Materials Science & Engineering, University of Washington, Seattle, Washington 98195, United States., Mishra H; Department of Mechanical Engineering and Texas Materials Institute, University of Texas, Austin, Texas 78712, United States., Liu Y; Department of Mechanical Engineering and Texas Materials Institute, University of Texas, Austin, Texas 78712, United States., Davydov AV; National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States., Stach EA; Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Jariwala D; Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.
Publikováno v:
ACS applied materials & interfaces [ACS Appl Mater Interfaces] 2023 Dec 27; Vol. 15 (51), pp. 59693-59703. Date of Electronic Publication: 2023 Dec 13.
Autor:
Horwath JP; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Lehman-Chong C; Department of Chemical and Biomolecular Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Vojvodic A; Department of Chemical and Biomolecular Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States., Stach EA; Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.
Publikováno v:
ACS nano [ACS Nano] 2023 May 09; Vol. 17 (9), pp. 8098-8107. Date of Electronic Publication: 2023 Apr 21.
Autor:
Horwath JP; University of Pennsylvania, Department of Materials Science and Engineering, Philadelphia, Pennsylvania 19104, United States., Voorhees PW; Northwestern University, Department of Materials Science and Engineering, Evanston, Illinois 60208, United States., Stach EA; University of Pennsylvania, Department of Materials Science and Engineering, Philadelphia, Pennsylvania 19104, United States.
Publikováno v:
Nano letters [Nano Lett] 2021 Jun 23; Vol. 21 (12), pp. 5324-5329. Date of Electronic Publication: 2021 Jun 10.
Autor:
Liang, Fengfeng1 (AUTHOR), Zhang, Yu1 (AUTHOR) zhangyu@ccsfu.edu.cn, Zhou, Chuntian1 (AUTHOR), Zhang, Heng1 (AUTHOR), Liu, Guangjie1 (AUTHOR) 756058599@qq.com, Zhu, Jinlong1 (AUTHOR)
Publikováno v:
PLoS ONE. 10/02/2024, Vol. 19 Issue 10, p1-15. 15p.
Autor:
Yoo, Timothy, Hershkovitz, Eitan, Yang, Yang, da Cruz Gallo, Flávia, Manuel, Michele V., Kim, Honggyu
Publikováno v:
NPJ Computational Materials; 9/18/2024, Vol. 10 Issue 1, p1-10, 10p
Publikováno v:
Construction Robotics; Dec2024, Vol. 8 Issue 2, p1-26, 26p
Autor:
Ramesh, Kaki, Mushtaq, Faisel, Deshmukh, Sandip, Ray, Tathagata, Parimi, Chandu, Basem, Ali, Elsheikh, Ammar
Publikováno v:
Beni-Suef University Journal of Basic & Applied Sciences; 8/19/2024, Vol. 13 Issue 1, p1-28, 28p
Autor:
Rettenberger, Luca, Szymanski, Nathan J., Zeng, Yan, Schuetzke, Jan, Wang, Shilong, Ceder, Gerbrand, Reischl, Markus
Publikováno v:
NPJ Computational Materials; 6/12/2024, Vol. 10 Issue 1, p1-9, 9p