Zobrazeno 1 - 10
of 173
pro vyhledávání: '"Horsley, DA"'
Autor:
Block, ST, Jiang, X, Harris, B, Cui, C, Fernandez, JS, Amirtharajah, R, Horsley, DA, Rashtian, H, Liu, XL
Publikováno v:
Block, ST; Jiang, X; Harris, B; Cui, C; Fernandez, JS; Amirtharajah, R; et al.(2017). A 170nW CMOS wake-up receiver with-60 dBm sensitivity using AlN high-Q piezoelectric resonators. Proceedings-IEEE International Symposium on Circuits and Systems. doi: 10.1109/ISCAS.2017.8050447. UC Davis: Retrieved from: http://www.escholarship.org/uc/item/2qm3k7w4
© 2017 IEEE. A new wake-up receiver (WuRx) designed in 0.13 μm CMOS process is hybrid-integrated with a micro-electromechanical system (MEMS) RF resonator. While only consuming 166 nW of power (18.8 nW for the comparator and 147 nW for periphery),
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______325::77b7b23d5898a390bab9842503bf249d
http://www.escholarship.org/uc/item/2qm3k7w4
http://www.escholarship.org/uc/item/2qm3k7w4
Publikováno v:
IEEE transactions on ultrasonics, ferroelectrics, and frequency control [IEEE Trans Ultrason Ferroelectr Freq Control] 2019 Sep; Vol. 66 (9), pp. 1488-1496. Date of Electronic Publication: 2019 Jun 10.
Autor:
Guedes A; Picosense Inc., Berkeley, CA 94704, USA. andre.guedes@picosense.com., Macedo R; Picosense Inc., Berkeley, CA 94704, USA. rita.macedo@picosense.com., Jaramillo G; Picosense Inc., Berkeley, CA 94704, USA. gerardo.jaramillo@picosense.com., Cardoso S; INESC Microsystems and Nanotechnologies and IN-Institute of Nanoscience and Nanotechnology, 1000-029 Lisbon, Portugal. scardoso@inesc-mn.pt.; Instituto Superior Tecnico, Universidade de Lisboa, Av. Rovisco Pais, 1000 Lisbon, Portugal. scardoso@inesc-mn.pt., Freitas PP; INESC Microsystems and Nanotechnologies and IN-Institute of Nanoscience and Nanotechnology, 1000-029 Lisbon, Portugal. Paulo.Freitas@inl.int., Horsley DA; Picosense Inc., Berkeley, CA 94704, USA. dahorsley@ucdavis.edu.; Berkeley Sensor and Actuator Center, University of California, Davis, CA 95616, USA. dahorsley@ucdavis.edu.
Publikováno v:
Sensors (Basel, Switzerland) [Sensors (Basel)] 2018 Mar 06; Vol. 18 (3). Date of Electronic Publication: 2018 Mar 06.
Autor:
Jiang X; Department of Mechanical Engineering, University of California, Berkeley, CA 94720, USA., Lu Y; Department of Mechanical and Aerospace Engineering, University of California, Davis, CA 95616, USA., Tang HY; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720, USA., Tsai JM; Invensense Inc., San Jose, CA 95110, USA., Ng EJ; Invensense Inc., San Jose, CA 95110, USA., Daneman MJ; Invensense Inc., San Jose, CA 95110, USA., Boser BE; Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720, USA., Horsley DA; Department of Mechanical and Aerospace Engineering, University of California, Davis, CA 95616, USA.
Publikováno v:
Microsystems & nanoengineering [Microsyst Nanoeng] 2017 Nov 20; Vol. 3, pp. 17059. Date of Electronic Publication: 2017 Nov 20 (Print Publication: 2017).
Publikováno v:
IEEE transactions on ultrasonics, ferroelectrics, and frequency control [IEEE Trans Ultrason Ferroelectr Freq Control] 2017 Sep; Vol. 64 (9), pp. 1401-1408. Date of Electronic Publication: 2017 May 11.
Akademický článek
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Akademický článek
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Autor:
Nitzan SH; University of California, Davis, CA, USA., Zega V; Politecnico di Milano, Milan, Italy., Li M; University of California, Davis, CA, USA., Ahn CH; Stanford University, Stanford, CA, USA., Corigliano A; Politecnico di Milano, Milan, Italy., Kenny TW; Stanford University, Stanford, CA, USA., Horsley DA; University of California, Davis, CA, USA.
Publikováno v:
Scientific reports [Sci Rep] 2015 Mar 12; Vol. 5, pp. 9036. Date of Electronic Publication: 2015 Mar 12.
Autor:
Yang, Guangcanlan, Wang, Haochen, Mu, Sai, Xie, Hao, Wang, Tyler, He, Chengxing, Shen, Mohan, Liu, Mengxia, Van de Walle, Chris G., Tang, Hong X.
Publikováno v:
Nature Communications; 11/4/2024, Vol. 15 Issue 1, p1-10, 10p
Autor:
Yu, Sheng, Sun, Jiangkun, Zhang, Yongmeng, Xi, Xiang, Lu, Kun, Shi, Yan, Xiao, Dingbang, Wu, Xuezhong
Publikováno v:
Microsystems & Nanoengineering; 11/5/2024, Vol. 10 Issue 1, p1-11, 11p