Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Hongqun Dong"'
Autor:
Glenn Ross, Hongqun Dong, Cyril Baby Karuthedath, Abhilash Thanniyil Sebastian, Tuomas Pensala, Mervi Paulasto-Kröckel
Publikováno v:
Materials & Design, Vol 196, Iss , Pp 109126- (2020)
Resonating piezoelectric devices, such as aluminum nitride (AlN) piezoelectric micromachined ultrasonic transducers (PMUTs), display superior performance to previous generations of resonating microelectromechanical systems (MEMS). However, the qualit
Externí odkaz:
https://doaj.org/article/7f076fbb12324efdafb49e13e0d2a406
Autor:
Vesa Vuorinen, Glenn Ross, Anneliese Ponninger, Tobias Wernicke, Anton Klami, Hongqun Dong, Mervi Paulasto-Kröckel
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology
openaire: EC/H2020/826588/EU//APPLAUSE The wafer-level Solid Liquid Interdiffusion (SLID) bonds carried out for this work take advantage of the Cu-In-Sn ternary system to achieve low temperature interconnections. The 100mm Si wafers had μ-bumps from
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::43cf90795de044465d1831320ad484d2
https://doi.org/10.1109/tcpmt.2021.3111345
https://doi.org/10.1109/tcpmt.2021.3111345
Publikováno v:
Journal of Electronic Materials
Funding Information: This work is part of the POSITION-II project funded by the ECSEL Joint Undertaking under grant number Ecsel-783132-Position-II-2017-IA. www.position-2.eu . The authors would like to acknowledge the Innovation Funding Agency Busin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::308c3b43021da9befea8d240ef33efe5
https://aaltodoc.aalto.fi/handle/123456789/108972
https://aaltodoc.aalto.fi/handle/123456789/108972
Autor:
Joseph Hotchkiss, Glenn Ross, Vesa Vuorinen, Hongqun Dong, Mervi Paulasto-Kröckel, Jani Kaaos, Tobias Wernicke, Anneliese Ponninger
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
openaire: EC/H2020/826588/EU//APPLAUSE The Solid Liquid Interdiffusion (SLID) bonds carried out for this work take advantage of the Cu-In-Sn ternary system to achieve low temperature wafer-level bonds. The experiments were carried out across a range
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::25a318c0d0ee692f1c331b16f2a614ee
https://aaltodoc.aalto.fi/handle/123456789/101431
https://aaltodoc.aalto.fi/handle/123456789/101431
Publikováno v:
Journal of Alloys and Compounds. 890:161852
Funding Information: This work was supported by the Innovation Funding Agency Business Finland. The work was conducted as part of the ?Silicon microfabrication platform development for next generation products - Beyond SOI? project (1364/31/2019). We
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e0a301b53d0aa7b00c86dedfdcb3f0b6
https://doi.org/10.1016/j.jallcom.2021.161852
https://doi.org/10.1016/j.jallcom.2021.161852
Publikováno v:
Journal of Materials Science: Materials in Electronics. 29:15212-15222
In this work, formation and evolution of microstructures in CuSn/Pt bonding were investigated after 320 °C reflow process as well as after high temperature storage test at 150 °C. Sputtered thin film platinum on silicon wafer and high purity platin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0e59975d57034e0dded2b44aee416045
https://doi.org/10.1007/s10854-018-9663-2
https://doi.org/10.1007/s10854-018-9663-2
Publikováno v:
Journal of Electronic Materials. 45:5478-5486
The interfacial reactions between the widely employed solder Au-20wt.%Sn and the common contact metallizations (e.g. Ni, Cu and Pt) are normally complex and not well determined. In order to identify the proper contactor for Au-20wt.%Sn solder, the pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::313edfd50e366fab0950b6650d9e9f0d
https://doi.org/10.1007/s11664-016-4733-9
https://doi.org/10.1007/s11664-016-4733-9
Publikováno v:
JOURNAL OF ALLOYS AND COMPOUNDS. 688:388-398
The Calphad method has been employed to reassess the thermodynamic description of the Au-Pt-Sn ternary system by remodeling the ternary compound and the solubility of the third elements in relevant binary compounds. A set of consistent parameters was
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6c962c94fd5e341e22054a42899169b6
http://juuli.fi/Record/0274596416
http://juuli.fi/Record/0274596416
Publikováno v:
Journal of Electronic Materials. 45:566-575
In this paper, the microstructural evolution and properties of Au-20wt.%Sn|Ni reaction couples were investigated from two perspectives: (1) by analyzing the microstructure of the as-soldered and aged samples, as well as (2) by measuring the mechanica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fc307f79fafd24e52775fd8e187bcb5
https://doi.org/10.1007/s11664-015-4152-3
https://doi.org/10.1007/s11664-015-4152-3
Thermodynamics and diffusion kinetics determine the microstructure of a given reaction couple between dissimilar materials under specific conditions. The microstructure, in turn, affects strongly the performance of multimaterial assemblies under diff
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85bcd9e569f01c1b6053423d2de6f8cc
https://doi.org/10.1016/b978-0-12-804548-0.00003-7
https://doi.org/10.1016/b978-0-12-804548-0.00003-7