Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Hongchen Meng"'
Publikováno v:
Materials Science in Semiconductor Processing. 154:107192
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39d560c89fbd7148f3dd2851d6867330
https://doi.org/10.1016/j.mssp.2022.107192
https://doi.org/10.1016/j.mssp.2022.107192
Autor:
Lang Zhou, Hongchen Meng
Publikováno v:
Silicon. 6:129-135
Poor mechanical property is identified as a potential barrier to commercial development of diamond wire sawn multi-crystalline silicon wafers. 3-point bending tests of the diamond-sawn multi-crystalline silicon wafer samples, along with those of mono
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c54975117fe4bdc678197c3df2e88f9
https://doi.org/10.1007/s12633-013-9170-2
https://doi.org/10.1007/s12633-013-9170-2