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pro vyhledávání: '"Hongan Geng"'
Publikováno v:
Journal of Materials Research and Technology, Vol 34, Iss , Pp 716-729 (2025)
Tungsten wire with high strength and toughness for silicon wafer cutting in photovoltaic industry is a new hot research content. In order to improve the strength and processing performance of tungsten wire, tungsten alloy containing 0.5 wt%La2O3 was
Externí odkaz:
https://doaj.org/article/b3211dc63ea0426abee9df291fc058c8