Zobrazeno 1 - 10
of 92
pro vyhledávání: '"Hong-chang Sun"'
Publikováno v:
Alexandria Engineering Journal, Vol 59, Iss 6, Pp 4669-4675 (2020)
Local fractional calculus has gained wide attention in the field of circuit design. In this paper, we propose the zero-input response(ZIR) of fractal RC circuit modeled by local fractional derivative(LFD) for the first time. With help of the law of s
Externí odkaz:
https://doaj.org/article/75e55ad618db4d8295db021d98502e8c
Publikováno v:
IEEE Access, Vol 8, Pp 166377-166383 (2020)
The local fractional derivative (LFD) has attracted wide attention in the field of engineering application. In this paper, the LFD is used to model the fractional Sallen-Key filter for the first time. The non-differentiable(ND) transfer function is o
Externí odkaz:
https://doaj.org/article/4e17810aadc842009747ff4aeaa045f9
Publikováno v:
Thermal Science. 2021, Vol. 25 Issue 2B, p1477-1481. 5p.
Publikováno v:
Micro and Nanosystems. 13:49-54
Background: With the increase in the integration degree of the three-dimensional Integrated Circuit ( 3D I C) , the thermal power consumption per unit volume increases greatly, which makes the chip temperature rise. High temperature could affect the
Publikováno v:
Alexandria Engineering Journal, Vol 59, Iss 6, Pp 4669-4675 (2020)
Local fractional calculus has gained wide attention in the field of circuit design. In this paper, we propose the zero-input response(ZIR) of fractal RC circuit modeled by local fractional derivative(LFD) for the first time. With help of the law of s
Publikováno v:
Thermal Science, Vol 23, Iss 4, Pp 2157-2162 (2019)
The through silicon via technology is a promising and preferred way to realize the reliable interconnection for 3-D integrated circuit integration. However, its size and the property of the filled-materials are two factors affecting the thermal behav
Autor:
Kang-Jia Wang1 konka05@163.com, Hong-Chang Sun2,3 kk121618@163.com, Cui-Ling Li4, Guo-Dong Wang1, Hong-Wei Zhu1
Publikováno v:
Thermal Science. 2018, Vol. 22 Issue 4, p1685-1690. 6p.
Publikováno v:
In NDT and E International 2008 41(7):534-543
Publikováno v:
Procedia CIRP. 76:67-72
For precision assembly of multiple species and variable batch productions, the existing problems are: assembly accuracy is low, and assembly efficiency is poor. This paper presents module design and optimization approaches for intelligent assembly sy
Publikováno v:
Thermal Science, Vol 22, Iss 4, Pp 1685-1690 (2018)
Vertical integration for microelectronics possesses significant challenges due to its fast dissipation of heat generated in multiple device planes. This paper focuses on thermal management of a 3-D integrated circuit, and micro-channel cooling is ado