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pro vyhledávání: '"Hong-Lin Lai"'
Autor:
Shang-Shian Yang, Hong-Lin Lai, Chih-Chia Chen, Shao-Tse Lu, Yu-Min Dai, Wen-Cheng Cheng, Yiin-Kuen Fuh, Tomi T. Li
Publikováno v:
Journal of Materials Research and Technology, Vol 30, Iss , Pp 2754-2767 (2024)
Physical Vapor Deposition (PVD) of Tantalum/Tantalum Nitride (Ta/TaN) liner and barrier plays a crucial role in the copper-interconnecting part of semiconductor manufacturing, and this is used for the 130 nm–5nm technology node and beyond. This stu
Externí odkaz:
https://doaj.org/article/8d5f527841494f8eadd011ef8296c296
Autor:
Hong-lin, Lai, Qiang, Li
Publikováno v:
Zhonghua jie he he hu xi za zhi = Zhonghua jiehe he huxi zazhi = Chinese journal of tuberculosis and respiratory diseases. 28(10)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::8572e4f5d91e021f3266e1ce0fcea6d0
https://pubmed.ncbi.nlm.nih.gov/16255961
https://pubmed.ncbi.nlm.nih.gov/16255961