Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Hong Miao Ji"'
Autor:
Hongyu Li, Hong Miao Ji, Gim Guan Chen, Alfred Neo Siang Kiat, Teo Wei Jie Dickson, K.-J. Chui
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f01db4d6bec3181adcdb2acce0d9202
https://doi.org/10.1109/eptc56328.2022.10013123
https://doi.org/10.1109/eptc56328.2022.10013123
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e809664655c216d4e6247c8a7281ff5b
https://doi.org/10.1109/eptc56328.2022.10013244
https://doi.org/10.1109/eptc56328.2022.10013244
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::737ac6228636d2dd0f8c439cfcc09867
https://doi.org/10.1109/eptc53413.2021.9663937
https://doi.org/10.1109/eptc53413.2021.9663937
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
This paper describes the demonstration of a 4-layer wafer stack using a combination of face-to-face and back-to-back, wafer-to-wafer hybrid bonding process. Details of process flow, process characterization and challenges in multi-layer wafer stackin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f5abb2af60d55abf7d5f030fdafa24a
https://doi.org/10.1109/eptc50525.2020.9315154
https://doi.org/10.1109/eptc50525.2020.9315154
Publikováno v:
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Recently, there has been an increasing use of 3D stack integration for high-performance computing applications. Wafer-to-wafer (W2W) hybrid bonding is a key technology in 3D stacking integration process. However, high-density Cu-Cu hybrid bonding int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f105e39ddb24354ae23536495ee78f77
https://doi.org/10.1109/ipfa49335.2020.9260626
https://doi.org/10.1109/ipfa49335.2020.9260626
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
This paper presents a 3D advanced numerical modelling methodology to simulate the bonding process for fine pitch TSV wafers using wafer to wafer hybrid bonding (W2W-HB) technology from thermo-mechanical viewpoint. Two critical results affecting bondi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fcc96f29904c5d0ef26fdc756273938
https://doi.org/10.1109/ectc32862.2020.00095
https://doi.org/10.1109/ectc32862.2020.00095
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
For Wafer to Wafer Hybrid Bonding (W2W-HB) technology, warpage mitigation and precise Cu to Cu bonding are required to ensure a robust bonding integrity. This paper documents a numerical methodology using the Finite Element Analysis (FEA) tool to inv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5c7715d6a626d28f059cd70b2f296e7
https://doi.org/10.1109/eptc47984.2019.9026578
https://doi.org/10.1109/eptc47984.2019.9026578
Publikováno v:
Hong Kong University of Science and Technology
This paper reports on the comparison analysis of four main types of silicon-based microfilter for isolation of white blood cells (WBCs) from red blood cells (RBCs) in a given whole blood. The microfilter designs, namely, weir, pillar, crossflow, and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::54a859bd61e1c40c67249b89bf0d6ee5
https://doi.org/10.1007/s10544-007-9131-x
https://doi.org/10.1007/s10544-007-9131-x
Autor:
Tit Meng Lim, Hong Miao Ji, Lin Cong, Victor Samper, Wing Cheong Hui, Fatimah Bte Mustafa, Yu Chen, Chew-Kiat Heng, Hui Jen Lye, Ai Cheng Lee
Publikováno v:
Sensors and Actuators A: Physical. 139:139-144
A silicon microchip has been developed for purification of deoxyribonucleic acid (DNA) from human blood based on the known affinity of DNA to silica under high chaotropic salt conditions. The chip comprises several components which include a micromix
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a562e1c0cd1b47dcd431ed64696919f
https://doi.org/10.1016/j.sna.2007.05.033
https://doi.org/10.1016/j.sna.2007.05.033
Publikováno v:
Biomedical Microdevices. 9:745-750
Cell loss during sample transporting from macro-components to micro-components in integrated microfluidic devices can considerably deteriorate cell detection sensitivity. This intrinsic cell loss was studied and effectively minimized through (a) incr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b8b24758a8e9581d0c76622ccf55e732
https://doi.org/10.1007/s10544-007-9085-z
https://doi.org/10.1007/s10544-007-9085-z