Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Hong Keun Ahn"'
Publikováno v:
IEEE Access, Vol 8, Pp 187754-187765 (2020)
The convolutional neural network (CNN)-based super-resolution (SR) has shown outstanding performance in the field of computer vision. The implementation of inference hardware for CNN-based SR has suffered from the intensive computation with severely
Externí odkaz:
https://doaj.org/article/5763f797fe0447f9a6df06fdc9748e65
Autor:
Sumin Lee, Ki-Beom Lee, Sunghwan Joo, Hong Keun Ahn, Junghyup Lee, Dohyung Kim, Bumsub Ham, Seong-Ook Jung
Publikováno v:
ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC).
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. 68:2481-2493
Essential design requirements for a sense amplifier (SA) used in the resistance monitoring write termination (RM-WT) scheme are suggested to reduce the write energy of spin-transfer-torque random access memory (STT-RAM) while achieving a write pass y
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 28:2650-2657
Cross-point-array nonvolatile ternary content-addressable memory (CPA nvTCAM) has recently emerged as an alternative to static random-access-memory-type TCAM, based on increased demands for high-capacity and low-power attributes. The CPA structure ha
Publikováno v:
2021 18th International SoC Design Conference (ISOCC).
Publikováno v:
2018 International Conference on Electronics, Information, and Communication (ICEIC).
The performance and power of the memory system cannot gradually follow the improving speed and power of the computational cores. To improve the memory performance, the L3 cache implemented with SRAM is generally used. However, the SRAM is not suitabl
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems; Dec2020, Vol. 28 Issue 12, p2650-2657, 8p
Publikováno v:
IEEE Transactions on Circuits & Systems. Part I: Regular Papers; Jun2021, Vol. 68 Issue 6, p2481-2493, 13p
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems; Feb2019, Vol. 27 Issue 2, p387-397, 11p