Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Hong Jiang Sun"'
Publikováno v:
Advanced Materials Research. :1788-1791
High-speed cutting technology is widely used in aviation, mold, automotive industries and other fields for its high machining efficiency, smaller cutting force, less cutting heat and high machining precision. However, the production site in China, hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a6493c5ec0b80bc9edb2ea9d0901ef9
https://doi.org/10.4028/www.scientific.net/amr.314-316.1788
https://doi.org/10.4028/www.scientific.net/amr.314-316.1788
Publikováno v:
Advanced Materials Research. 142:262-265
In this paper, the machining process of integrated impeller is customized basing on the geometry feature, function characteristics and the processing difficulties. Considering the working performance and machining rigidity, the rough machining and fi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a45d0d1afb470d812ac42767bd6d64a
https://doi.org/10.4028/www.scientific.net/amr.142.262
https://doi.org/10.4028/www.scientific.net/amr.142.262
Autor:
B. Ittermann, L. Jeyanathan, Hong-Jiang Sun, Sergei S. Ostapenko, M. Singh, W.A. Barry, Edward C. Lightowlers, Paul R.D. Mason, Gavin Davies, George D. Watkins
Publikováno v:
Materials Science Forum. :1167-1172
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f690d1fa684cb8a7c01277f286821b09
https://doi.org/10.4028/www.scientific.net/msf.143-147.1167
https://doi.org/10.4028/www.scientific.net/msf.143-147.1167
Publikováno v:
Materials Science Forum. :935-940
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b97c2c070d4bb6de90fc735b8c80940
https://doi.org/10.4028/www.scientific.net/msf.83-87.935
https://doi.org/10.4028/www.scientific.net/msf.83-87.935
Autor:
John Francis Valley, Noel Poduje, Chris Koliopoulus, Winthrop A. Baylies, Hong Jiang Sun, Pat Hester, Duane S. Boning, Dale L. Hetherington, Michael S. Lacy, Brian Lee, Yong Xia
Publikováno v:
MRS Proceedings. 671
Nanotopography refers to 10-100 nm surface height variations that exist on a lateral millimeter length scale on unpatterned silicon wafers. Chemical mechanical polishing (CMP) of deposited or grown films (e.g., oxide or nitride) on such wafers can ge
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96e340b628f06d1740a49eda84fb2e98
https://doi.org/10.1557/proc-671-m4.9
https://doi.org/10.1557/proc-671-m4.9