Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Homing Tong"'
Autor:
Homing Tong, Ker-Chang Hsieh, Simon Su, Tom Tai, Adren Hsieh, Jui-I Yu, Rick Yu, Walter Jau, Danial Huang
Publikováno v:
2006 International Microsystems, Package, Assembly Conference Taiwan.
Wafer bumping is growing in importance with the increasing used of Flip Chip package. In this study, we tried to determine which factors at photosensitive film lithography process had an effect on photosensitive film sidewall profile. The analysis of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b999c1e768858c582634099b587b2c2e
https://doi.org/10.1109/impact.2006.312207
https://doi.org/10.1109/impact.2006.312207
Publikováno v:
56th Electronic Components and Technology Conference 2006.
Wafer bumping is growing in importance with the increasing used of flip chip package. In this study, we tried to determine which factors at photosensitive film lithography process had an effect on photosensitive film sidewall profile. The analysis of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46624a4233894559232a1ce12b3f733e
https://doi.org/10.1109/ectc.2006.1645782
https://doi.org/10.1109/ectc.2006.1645782
Autor:
C.H. Kang, Ker-Chang Hsieh, J. Taguibao, Homing Tong, Jami Chen, T. Tai, R. Yu, Jui-I Yu, Mars Tsai
Publikováno v:
2005 7th Electronic Packaging Technology Conference.
A technique for 100 mum fine pitch bump process characteristics with stack thin film as under bump metallization structure, such as Ti/Cu/Ni and Ti/NiV/Cu were investigated and appropriated these UBM structure for height density solder bump as interc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb0ae3fe602ec36b0e504f50f35652b8
https://doi.org/10.1109/eptc.2005.1614455
https://doi.org/10.1109/eptc.2005.1614455
Publikováno v:
IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585).
Major improvements over the last four years have removed and reduced many of these barriers with the transition from 150mm, 200mm to 300mm process wafers; wafer bumping is growing in importance with the increasing use of flip chip package; the challe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a25373f591b0e2117e3cacba9fa055e
https://doi.org/10.1109/iemt.2004.1321622
https://doi.org/10.1109/iemt.2004.1321622
Publikováno v:
IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585); 2004, p5-9, 5p
Autor:
Jui-i Yu, Yu, R., Tai, T., Huang, D., Jau, W., Ker-Chang Hsieh, Hsieh, A., Su, S., Homing Tong
Publikováno v:
2006 International Microsystems, Package, Assembly Conference Taiwan; 2006, p1-3, 3p
Publikováno v:
56th Electronic Components & Technology Conference 2006; 2006, p5-5, 1p
Autor:
Yu, R., Jui-I Yu, Tai, T., Kang, C.H., Jami Chen, Taguibao, J., Mars Tsai, Homing Tong, Ker-Chang Hsieh
Publikováno v:
2005 7th Electronic Packaging Technology Conference; 2005, p6-6, 1p