Zobrazeno 1 - 10
of 53
pro vyhledávání: '"Holger Kappert"'
Autor:
Ingo Hoyer, Alexander Utz, André Lüdecke, Holger Kappert, Maurice Rohr, Christoph Hoog Antink, Karsten Seidl
Publikováno v:
Sensors, Vol 23, Iss 5, p 2703 (2023)
Atrial Fibrillation (AF) is one of the most common heart arrhythmias. It is known to cause up to 15% of all strokes. In current times, modern detection systems for arrhythmias, such as single-use patch electrocardiogram (ECG) devices, have to be ener
Externí odkaz:
https://doaj.org/article/ac5d13cedc1e4200b05e8b3ec5d21b6f
Autor:
Malte Spanier, Jakub Pawlikowski, Steffen Ziesche, Holger Kappert, Andreas Ostmann, Martin Jagle, Martin Schneider-Ramelow
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Autor:
Norbert Kordas, Alexander Utz, Andre Kosfeld, Olaf Rämer, Sebastian Braun, Steffen Ziesche, Martin Ihle, Rainer Kokozinski, Constanze Weber, Malte Spanier, Holger Kappert
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2021:000018-000024
Sensors are key elements for capturing environmental properties and are increasingly important in the industry for the intelligent control of industrial processes. While in many everyday objects highly integrated sensor systems are already state of t
Autor:
Holger Kappert, Sebastian Schopferer, Nooshin Saeidi, Ralf Döring, Steffen Ziesche, Alexander Olowinsky, Falk Naumann, Martin Jägle, Malte Spanier, Anton Grabmaier
Sensors are key elements for capturing environmental properties and are today indispensable in the industry for monitoring and control of industrial processes. Many applications are demanding for highly integrated intelligent sensors to meet the requ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7d80a9c3d56380e8998c73775f0a4699
https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&origin=inward&scp=85147529042
https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&origin=inward&scp=85147529042
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2019:000112-000116
In this paper we present an integrated circuit for inductive proximity switches which requires very few external components and can operate under ambient temperatures up to 250 °C. The sensor system is realized in the Fraunhofer IMS H035 technology
Autor:
Holger Kappert, Steffen Ziesche, Adrian Goldberg, Falk Naumann, Uwe Partsch, Heidrun Kind, Mirko Aden
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2019:000107-000111
The contribution evaluates the potential of piezoresistive multilayer ceramic sensory solutions using Low or High Temperature Cofired Ceramics (LTCC/HTCC) for on-turbine sensors. Relevant ceramic materials were characterized and evaluated with regard
Autor:
Holger Kappert, A. Ostmann, A. Olowinsky, M. Jägle, Steffen Ziesche, S. Schopferer, Falk Naumann, Ralf Doring
Publikováno v:
SMSI 2021 - Sensors and Instrumentation.
Autor:
Sebastian Braun, Andreas Kelberer, Norbert Kordas, Holger Kappert, Stefan Dreiner, Rainer Kokozinski, Michael Alfring
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:000042-0000045
Various applications require the storage of program code or calibration data inside a non-volatile memory. In many cases data is programmed one time e.g. during initial test or calibration and needs to be stored and readable over the whole lifetime o
Fabrication of Partly Encapsulated Vertical Nanoelectrodes for an Intracellular Microelectrode Array
Publikováno v:
2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII).
In this work, a concept and proof of principle regarding a fabrication technique for vertical nanoelectrodes is presented. CMOS-compatible processes for the fabrication of three-dimensional tubes which are partly encapsulated by an insulation layer a
Publikováno v:
PRIME
To further optimize micro pellistors and reduce the required chip area, one possibility is to fabricate the sensor on top of the integrated circuit (IC). Therefore, a sacrificial layer process developed by the Fraunhofer IMS combining deep reactive i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d5e5d98b99c18177f53c7324e0489ac3
https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&origin=inward&scp=85071309289
https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&origin=inward&scp=85071309289