Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Holger Kapels"'
Publikováno v:
Micromachines, Vol 13, Iss 3, p 347 (2022)
The paper presents the realization and characterization of micro-inductors with core with active cooling capability for future integrated DC/DC converter solutions operating with wide bandgap semiconductors at high temperatures with high power densit
Externí odkaz:
https://doaj.org/article/d49a3899acd444caaa34dd77f39f0e06
Autor:
Simon Fichtner, Georg Schönweger, Frank Dietz, Henning Hanssen, Heiko Züge, Tom-Niklas Kreutzer, Fabian Lofink, Hermann Kohlstedt, Holger Kapels, Michael Mensing
Publikováno v:
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Publikováno v:
2020 IEEE Applied Power Electronics Conference and Exposition (APEC).
This paper presents the development, processing and investigation of micro-inductances on silicon having an inductance of about 150nH and a resistance of 0.66Ω. The core of the inductances, 1mm x 3.4mm x 0.6mm in size, is fabricated on silicon subs
Publikováno v:
2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe).
This paper presents a novel control concept for the bidirectional non-inverting buck-boost converter to achieve extreme high-efficiency power conversion. The duty cycle, duty ratios and time delays of the PWM control signals for the switches are modu
Autor:
Franz Hirler, Holger Kapels
Publikováno v:
2009 21st International Symposium on Power Semiconductor Devices & IC's.
The drift zone of superjunction devices consists of compensated n- and p-columns. The manufacturability of such devices is based on the thorough control of acceptors and donator concentrations. Shrinking the cell pitch to a few micrometers requires c
Publikováno v:
2006 International Conference on Advanced Semiconductor Devices and Microsystems.
New lateral power MOSFETs employing two different, non-uniform, column-shaped superjunction (SJ) structures are proposed for use in smart power ICs that require voltage ratings up to 600V. Using three-dimensional device simulations, the basic electri
Autor:
Stefan Sedlmaier, C. Tolksdorf, A. Willmeroth, M. Rub, M. Bar, G. Deml, Holger Kapels, M. Schmitt
Publikováno v:
2006 IEEE International Symposium on Power Semiconductor Devices & IC's.
In this work we present for the first time experimental results and corresponding device simulations for high voltage lateral superjunction MOSFETs. We investigated experimentally various degrees of compensation for the lateral compensation structure
Publikováno v:
2006 25th International Conference on Microelectronics.
The inductive switching performance of a smart super-junction (SJ) LDMOS switch is simulated and analysed, together with the reverse recovery properties of its internal diode. The SJ power switch under investigation differs from the conventional one
Publikováno v:
2005 International Conference On Simulation of Semiconductor Processes and Devices.
A novel 600V super-junction (SJ) power LDMOS device with two different designs of SJ structures has been proposed. The basic SJ structure consists of a number of p-type round pillars buried in an n-type drift layer down to a p-type substrate. Perform
Publikováno v:
12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094).
The progress in SOI technologies, especially SIMOX and Silicon Direct Bonding, suggests a new type of structural element which could improve device blocking behavior in various aspects. A novel structure element for realizing high breakdown voltages