Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Hoi-Jin Lee"'
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff10f46f63bb28edfcb319d852241f99
https://doi.org/10.1109/ectc51906.2022.00157
https://doi.org/10.1109/ectc51906.2022.00157
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In this paper, we analyze the heat generation characteristics of components in a multi-stack PCB (Printed Circuit Board) structure of smart phone and find the optimized structure of components placement to minimize system temperature. The PCB in a sm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ae1caa41aece040eae8b78d81490485
https://doi.org/10.1109/itherm45881.2020.9190384
https://doi.org/10.1109/itherm45881.2020.9190384
Autor:
Heeseok Lee, Myunghoon Lee, Jongkyu Yoo, Young-Sang Cho, Hoi-Jin Lee, Taekeun An, Yunhyeok Im, Youngmin Shin, Vamsi Krishna Yaddanapudi, Wook Kim
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
On-chip thermal sensor (TS) is essential to prevent a chip from burn out and to increase its reliability. In addition, accuracy of temperature reading can affect to the performance and the power consumption of chip. We propose methodology for optimal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c5e1829974d51305fa834b198cc2ade
https://doi.org/10.1109/itherm45881.2020.9190609
https://doi.org/10.1109/itherm45881.2020.9190609
Autor:
Hoi-Jin Lee, Heeseok Lee, Youngmin Shin, Yunhyeok Im, Young-Sang Cho, Taekeun An, Jongkyu Yoo
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Recently, the power density has been increasing due to the high bandwidth of 5G mobile devices and it leads to temperature rise. Increased temperature reduces lifetime by quality deterioration and degrade performance with thermal throttling. Therefor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcc3875afae7a6eaa1093c8b0c9b59da
https://doi.org/10.1109/itherm45881.2020.9190945
https://doi.org/10.1109/itherm45881.2020.9190945
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this paper, the methods for improving the PI (Power Integrity) of low power SOC (System-On-Chip) are discussed. In order to confirm the PI improvement effect by using MIM (Metal-Insulator-Metal), system-level PDN impedance and voltage drop was ana
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1560e58466d183baac18e1fdab9a04fe
https://doi.org/10.1109/ectc32862.2020.00343
https://doi.org/10.1109/ectc32862.2020.00343
Autor:
Heejung Choi, Hoi-Jin Lee, Yunhyeok Im, Yohan Kwon, Jisoo Hwang, James Jeong, Young-Sang Cho, Jongkyu Yoo, Heeseok Lee, Youngmin Shin
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Heat removal and power integrity have become major concerns in floor-planning of heterogeneous multi core in system on a chip (SOC). Heterogeneous multi core brings new challenges to balance thermal and power point of view because optimal floor-plan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::71732db221703dc2d2849933d471bfb8
https://doi.org/10.1109/ectc32862.2020.00321
https://doi.org/10.1109/ectc32862.2020.00321
Autor:
James Jeong, Heeseok Lee, Hoi-Jin Lee, Heejung Choi, Junghwa Kim, Yohan Kwon, Jisoo Hwang, Youngmin Shin, Kyoung-Soo Kim, Je-Gil Moon
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this paper, PI (Power Integrity) performance of interposer package-on-package (POP) is analyzed with respect to types of package decoupling capacitors and relative location of package decoupling capacitors to CPU (Central Processing Unit) PDN (Pow
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7c26cf9d9b268e68a5ea58775fe7be4
https://doi.org/10.1109/ectc32862.2020.00074
https://doi.org/10.1109/ectc32862.2020.00074
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Firmly understanding the power supply current profile (PSCP) of various scenarios used in real use cases is essential for the simulation and design of power delivery network (PDN) of system-on-chip (SOC) to maximize processor’s performance within l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aaf144b176c9bb6c684050c53beac5f7
https://doi.org/10.1109/ectc32862.2020.00276
https://doi.org/10.1109/ectc32862.2020.00276
Publikováno v:
Journal of Nanoscience and Nanotechnology. 18:6455-6458
Tin-based materials, due to their high theoretical capacity of 994 mAh g-1 are potential candidates which can substitute the commercialized graphite anodes (372 mAh g-1). However, practical usage of pure tin in Li-ion cells has been hampered by the t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fffd0ab2554a271713af787aec499eeb
https://doi.org/10.1166/jnn.2018.15683
https://doi.org/10.1166/jnn.2018.15683
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Increasing the clock frequency of IO system with LPDDR4 and LPDDR5 in SOC (system on a chip) has escalated the importance of SI on the functional stability and low power operation of the circuit blocks, because the challenge to design and verificatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c17c9ee2d6aed265c3bff92dd3ab37c6
https://doi.org/10.1109/eptc47984.2019.9026595
https://doi.org/10.1109/eptc47984.2019.9026595