Zobrazeno 1 - 10
of 100
pro vyhledávání: '"Hoang-Vu Nguyen"'
Publikováno v:
Nanomaterials, Vol 14, Iss 1, p 20 (2023)
For uncooled infrared cameras based on microbolometers, silicon caps are often utilized to maintain a vacuum inside the packaged bolometer array. To reduce Fresnel reflection losses, anti-reflection coatings are typically applied on both sides of the
Externí odkaz:
https://doaj.org/article/87a418f44f4443efa7ba5abd2ada33f8
Publikováno v:
Polymers, Vol 15, Iss 6, p 1552 (2023)
Materials providing heat dissipation and electrical insulation are required for many electronic and medical devices. Polymer composites with hexagonal boron nitride (hBN) may fulfil such requirements. The focus of this study is to compare composites
Externí odkaz:
https://doaj.org/article/678d2a97b8e349298b92271c454d9515
Publikováno v:
IEEE Access, Vol 6, Pp 70212-70222 (2018)
This paper proposes a single-phase onboard battery charger (OBC) for plug-in electric vehicles, where the low-voltage (LV) battery charging circuit is utilized for an active power decoupling function. The OBC is operated in three different modes by s
Externí odkaz:
https://doaj.org/article/7d3c3660e57841b0bfabd2585969ff66
Publikováno v:
Journal of Electronic Materials. 52:1284-1294
Solid–liquid interdiffusion is a metallurgical bonding technique, suitable for assembly of temperature sensitive materials. We identify Ag-(In-Bi) as meeting the low-temperature bonding requirements, theoretically as low as 73°C. This work focuses
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91314bef0eca1d193be67b3285040530
https://doi.org/10.1007/s11664-022-10063-5
https://doi.org/10.1007/s11664-022-10063-5
Autor:
Tuan Linh Dang, Huu Thang Nguyen, Duc Manh Dao, Hoang Vu Nguyen, Duc Long Luong, Ba Tuan Nguyen, Suntae Kim, Nicolas Monet
Publikováno v:
Neural Computing and Applications. 34:21849-21862
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b1660f3d79e422d7ceadcd010aaa6143
https://doi.org/10.1007/s00521-022-07651-1
https://doi.org/10.1007/s00521-022-07651-1
Publikováno v:
IEEE Transactions on Power Electronics. 37:8177-8189
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::981dc622a8734bf515d0500f1ea4cad9
https://doi.org/10.1109/tpel.2022.3152501
https://doi.org/10.1109/tpel.2022.3152501
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac627279a086565e01d4ed64b310442c
https://doi.org/10.1109/estc55720.2022.9939469
https://doi.org/10.1109/estc55720.2022.9939469
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcea36edbc07f626718d6bf65b709a38
https://doi.org/10.1109/estc55720.2022.9939439
https://doi.org/10.1109/estc55720.2022.9939439
Autor:
Chowdam Venkata Prasad, Madani Labed, Mohammad Tauquir Alam Shamim Shaikh, Ji Young Min, Tan Hoang Vu Nguyen, Wonjin Song, Kyong Jae Kim, You Seung Rim
Publikováno v:
Materials Today Physics. 35:101095
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4569cad88143d9a88d12e34746d23da8
https://doi.org/10.1016/j.mtphys.2023.101095
https://doi.org/10.1016/j.mtphys.2023.101095