Zobrazeno 1 - 10
of 86
pro vyhledávání: '"HoYoung Song"'
Autor:
Jiryang Kim, Dowon Pyun, Dongjin Choi, Seok-Hyun Jeong, Changhyun Lee, Jiyeon Hyun, Ha Eun Lee, Sang-Won Lee, Hoyoung Song, Solhee Lee, Donghwan Kim, Yoonmook Kang, Hae-Seok Lee
Publikováno v:
Energies, Vol 15, Iss 3, p 870 (2022)
In this work, nickel silicide was applied to tandem solar cells as an interlayer. By the process of thermal evaporation, a layer of NiOx, hole transport layer (HTL) was deposited on n+ poly-Si layer directly. Nickel silicide was simultaneously formed
Externí odkaz:
https://doaj.org/article/26d509465d95435fa8aa86b6574bb05d
Autor:
Changhyun Lee, Jiyeon Hyun, Jiyeon Nam, Seok-Hyun Jeong, Hoyoung Song, Soohyun Bae, Hyunju Lee, Jaeseung Seol, Donghwan Kim, Yoonmook Kang, Hae-Seok Lee
Publikováno v:
Energies, Vol 14, Iss 24, p 8199 (2021)
Tunnel oxide passivated contact (TOPCon) solar cells are key emerging devices in the commercial silicon-solar-cell sector. It is essential to have a suitable bottom cell in perovskite/silicon tandem solar cells for commercial use, given that good can
Externí odkaz:
https://doaj.org/article/7ec71a85fe5c457c92e4b1d14da9b4b2
Autor:
Hoyoung Song, Changhyun Lee, Jiyeon Hyun, Sang-Won Lee, Dongjin Choi, Dowon Pyun, Jiyeon Nam, Seok-Hyun Jeong, Jiryang Kim, Soohyun Bae, Hyunju Lee, Yoonmook Kang, Donghwan Kim, Hae-Seok Lee
Publikováno v:
Energies, Vol 14, Iss 11, p 3108 (2021)
Monolithic perovskite–silicon tandem solar cells with MoOx hole selective contact silicon bottom solar cells show a power conversion efficiency of 8%. A thin 15 nm-thick MoOx contact to n-type Si was used instead of a standard p+ emitter to collect
Externí odkaz:
https://doaj.org/article/e5afc6729fe2443292a44a80f3ba7cde
Autor:
Changhyun Lee, Soohyun Bae, HyunJung Park, Dongjin Choi, Hoyoung Song, Hyunju Lee, Yoshio Ohshita, Donghwan Kim, Yoonmook Kang, Hae-Seok Lee
Publikováno v:
Energies, Vol 13, Iss 3, p 678 (2020)
Recently, titanium oxide has been widely investigated as a carrier-selective contact material for silicon solar cells. Herein, titanium oxide films were fabricated via simple deposition methods involving thermal evaporation and oxidation. This study
Externí odkaz:
https://doaj.org/article/bec9717fbd674076910f94af6f0f1f6d
Autor:
Kyungsan Kim, Hyunseok Kim, Jinin So, Wonjae Lee, Junhyuk Im, Sungjoo Park, Jeonghyeon Cho, Hoyoung Song
Publikováno v:
IEEE Micro. 43:20-29
Autor:
Dowon Pyun, Sang-Won Lee, Youngwoong Kim, Gyeong Sun Jang, Dongjin Choi, Seok Hyun Jeong, Hoyoung Song, Solhee Lee, Sujin Cho, Jiryang Kim, Dongkyun Kang, Ha Eun Lee, Ji Yeon Hyun, Changhyun Lee, HyunJung Park, Jae-Keun Hwang, Wonkyu Lee, Nam Joong Jeon, Jangwon Seo, Yoonmook Kang, Donghwan Kim, Hae-Seok Lee
Publikováno v:
ACS Applied Energy Materials. 6:2687-2697
Autor:
Daewoong Lee, Jaehyeok Baek, Hye-Jung Kwon, Dae-Hyun Kwon, Chulhee Cho, Sang-Hoon Kim, Donggun An, Chulsoon Chang, Unhak Lim, Jiyeon Im, Wonju Sung, Hye-Ran Kim, Sun-Young Park, Hyoung-Joo Kim, Hoseok Seol, Juhwan Kim, Jungbum Shin, Gil-Young Kang, Yong-Hun Kim, Sooyoung Kim, Wansoo Park, Seok-Jung Kim, Chan-Yong Lee, Seungseob Lee, Tae-Hoon Park, Chi-Sung Oh, Hyodong Ban, Hyungjong Ko, Hoyoung Song, Tae-Young Oh, Sang-Joon Hwang, Kyung-Suk Oh, Jung-Hwan Choi, Jooyoung Lee
Publikováno v:
IEEE Journal of Solid-State Circuits. 58:279-290
Autor:
Ji Yeon Hyun, Kyung Mun Yeom, Sang-Won Lee, Soohyun Bae, Dongjin Choi, Hoyoung Song, Dongkyun Kang, Jae-Keun Hwang, Wonkyu Lee, Solhee Lee, Yoonmook Kang, Hae-Seok Lee, Jun Hong Noh, Donghwan Kim
Publikováno v:
ACS Applied Energy Materials. 5:5449-5456
Autor:
Yun-Ho Lee, Dongyeop Kim, SangKeun Kwak, Jeonghun Baek, Kyoungsun Kim, Sung Joo Park, Jeonghyeon Cho, Hoyoung Song
Publikováno v:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Autor:
WonSuk Choi, SangKeun Kwak, Jaeseok Park, Jiyoung Do, Byeongseon Yun, Yoo-Jeong Kwon, Dongyeop Kim, Kyudong Lee, Tae Young Kim, Wonyoung Kim, Kyoungsun Kim, Sung Joo Park, Jeonghyeon Cho, Hoyoung Song
Publikováno v:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).