Zobrazeno 1 - 2
of 2
pro vyhledávání: '"HoDol Yoo"'
Autor:
GyuIck Jung, SooHyun Kim, HoDol Yoo, WonChul Do, TaeKyeong Hwang, WonMyoung Ki, JaeHun Bae, InSu Mok, SeungMan Ryu
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a wafer-level compression molding process. The redistribution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57f86d541912049fab1dc55bb89e4dc6
https://doi.org/10.1109/eptc50525.2020.9315128
https://doi.org/10.1109/eptc50525.2020.9315128
Autor:
Woohyun Paik, SeungNam Son, WonChul Do, Kwangsup So, HoDol Yoo, Yun Ra, DooWon Lee, KangWook Lee, Ji Hyun Kim, JooHyun Kim
Publikováno v:
2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM).
A new Wafer Level System-in-Package (WLSiP) has been designed and developed where Application Processor (AP), Low Power Double Data Rate 4 (LPDDR4) memory, and Power Management Integrated Circuit (PMIC) semiconductor technologies as well as passive c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e899f3cfc087582a97228b96fda2703b
https://doi.org/10.1109/edtm.2018.8421528
https://doi.org/10.1109/edtm.2018.8421528