Zobrazeno 1 - 10
of 65
pro vyhledávání: '"Ho-Ming Tong"'
Publikováno v:
IEEE Journal of Photovoltaics. 9:898-905
The addition of Ag to Cu-Ga-In precursors for synthesizing (Ag,Cu)(In,Ga)Se2 (ACIGS) thin films has shown benefits including improved adhesion, greater process tolerance, and potential for improved device performance. In this study, reaction pathways
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b5415a27544f6a9c8142374f8bf4654
https://doi.org/10.1109/jphotov.2019.2897582
https://doi.org/10.1109/jphotov.2019.2897582
Publikováno v:
2020 47th IEEE Photovoltaic Specialists Conference (PVSC).
The substitution of Ag for Cu in Cu(Ga, In)Se 2 has been shown to optimize the bandgap of the chalcopyrite while decreasing defect density and formation temperature. The synthesis of chalcopyrite via selenization of metal precursor films with a compl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26d0cbcbe6efd51a1f5e036e2badd609
https://doi.org/10.1109/pvsc45281.2020.9300659
https://doi.org/10.1109/pvsc45281.2020.9300659
Publikováno v:
Progress in Photovoltaics: Research and Applications. 26:825-834
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9bbfdd20b99e4638705a3da54c69cbdc
https://doi.org/10.1002/pip.3022
https://doi.org/10.1002/pip.3022
Co-evaporation of Cu-KF-In-Se was performed on substrates with varied surface Na compositions. Compositions of interest for photovoltaic absorbers were studied, with ratios of (K+Cu)/In ~ 0.85 and K/(K+Cu) ~ 0 - 0.57. Soda-lime glass (SLG) substrates
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::01314a280767d5c1a087bcdf9ed3e1b8
Autor:
Wei Hwang, Yan-Pin Huang, Kuan-Neng Chen, Ho-Ming Tong, Ching-Te Chuang, Yu-San Chien, Ruoh-Ning Tzeng, Jin-Chern Chiou, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Chi-Tsung Chiu
Publikováno v:
IEEE Transactions on Electron Devices. 61:1131-1136
Low-temperature (170°C) Cu/In wafer-level and chip-level bonding for good thermal budget has been successfully developed for 3-D integration applications. For the well-bonded interconnect, Cu2In and Cu7In3 phases with high melting temperature of 388
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b39e348f8034af42707b711269c85bf
https://doi.org/10.1109/ted.2014.2304778
https://doi.org/10.1109/ted.2014.2304778
Autor:
Chih-Pin Hung, Ding-Bang Luh, Ho-Ming Tong, Colin Liu, Emma Hsieh, Yi-Shao Lai, Shin-Hua Chao
Publikováno v:
Journal of the Chinese Institute of Engineers. 37:827-832
Flip-chip chip-scale packaging (FCCSP) has recently emerged as a package solution achieving superior performance over traditional wire-bonding technology. There are also further possible advances for the assembly process such as under-fill and moldin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::054b13804221a2814c04d148178a61cd
https://doi.org/10.1080/02533839.2013.839424
https://doi.org/10.1080/02533839.2013.839424
Autor:
Jin-Chern Chiou, Ho-Ming Tong, Ching-Te Chuang, Chi-Tsung Chiu, Yu-Chen Hu, Shih-Wei Lee, Kuan-Neng Chen, Kuo-Hua Chen, Wei Hwang, Cheng-Hao Chiang
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001817-001845
Three-dimensional (3D) integration method has become the candidate to extend the Moore's law due to its heterogeneous integration, multiple functionality, and low power consumption. To realize 3D integration, Through-silicon via (TSV) has emerged as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ab19a91480bf5e848955cad4e3a2d36
https://doi.org/10.4071/2013dpc-tha12
https://doi.org/10.4071/2013dpc-tha12
Autor:
Chih-Pin Hung, Chi-Han Chen, Pao-Nan Lee, Meng-Jen Wang, Kuan-Chung Lu, Chang-Ying Hung, Tzyy-Sheng Horng, Ho-Ming Tong
Publikováno v:
International Symposium on Microelectronics. 2012:001215-001220
TSV (Through Silicon Via) is the key enabling technology for 2.5D & 3D IC stacking solution in FCBGA (Flip Chip Ball Grid Array). As the 2.5D interposer design pushing toward smaller & shorter via due to high I/O density and high frequency requiremen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a27f63dec7829fe09031e4e8865d0721
https://doi.org/10.4071/isom-2012-thp62
https://doi.org/10.4071/isom-2012-thp62
Autor:
Kuan-Neng Chen, Chi-Tsung Chiu, Ching-Te Chuang, Cheng-Hao Chiang, Ho-Ming Tong, Jin-Chern Chiou, Lei-Chun Chou, Chung-Hsi Wu, Po-Tsang Huang, Shih-Wei Lee, Kuo-Hua Chen, Shang-Lin Wu, Wei Hwang, Chih-Wei Chang
Publikováno v:
IEEE Electron Device Letters. 35:256-258
Bio-signal probes providing stable observation with high quality signals are crucial for understanding how the brain works and how the neural signal transmits. Due to the weak and noisy characteristics of bio-signals, the connected interconnect lengt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b939916dab2c5b73603f14cbd5cdca27
https://doi.org/10.1109/led.2013.2293399
https://doi.org/10.1109/led.2013.2293399
Publikováno v:
Progress in Photovoltaics: Research and Applications. 26:i-i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f394574cae4190beaaa48cef0b9ef4e0
https://doi.org/10.1002/pip.3074
https://doi.org/10.1002/pip.3074