Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Ho-Chuan Lin"'
Publikováno v:
Micromachines, Vol 14, Iss 2, p 265 (2023)
The transmission characteristics of the printed circuit board (PCB) ensure signal integrity and support the entire circuit system, with impedance matching being critical in the design of high-speed PCB circuits. Because the factors affecting impedanc
Externí odkaz:
https://doaj.org/article/491cdb1909354190b22af590ad29fee4
Publikováno v:
Micromachines, Vol 13, Iss 8, p 1305 (2022)
For electronic products, printed circuit boards are employed to fix integrated circuits (ICs) and connect all ICs and electronic components. This allows for the smooth transmission of electronic signals among electronic components. Machine learning (
Externí odkaz:
https://doaj.org/article/c84732707d1543f1a669849474cdc460
Publikováno v:
Energies, Vol 12, Iss 11, p 2168 (2019)
With a much larger global warming potential (GWP) and much shorter lifespan, the reduction of methane emissions offers an additional opportunity and a relatively quick way of mitigating climate change in the near future. However, the emissions from c
Externí odkaz:
https://doaj.org/article/89668420b0a348209b6ba59cd28f12ad
Autor:
Ho-Chuan Lin, 林河川
97
This study aims to investigate interactive parallel lean and sub-limit lean premixed methane-air flames issued from two or three rectangular slot burners with variable jet spacing, equivalence ratio and burner exit speed. The twin-jet flames
This study aims to investigate interactive parallel lean and sub-limit lean premixed methane-air flames issued from two or three rectangular slot burners with variable jet spacing, equivalence ratio and burner exit speed. The twin-jet flames
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/71496489633220071370
Publikováno v:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Gallium nitride (GaN)-based high-electron-mobility transistor (HEMT) power devices have advantage like high voltage operation, high temperature application and high switch speed compared to the traditional silicon (Si)-based semiconductor devices. Du
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5ab9028cde4a47420d37b4b5cdba6bb
https://doi.org/10.1109/impact47228.2019.9024969
https://doi.org/10.1109/impact47228.2019.9024969
Publikováno v:
Energies; Volume 12; Issue 11; Pages: 2168
Energies, Vol 12, Iss 11, p 2168 (2019)
Energies, Vol 12, Iss 11, p 2168 (2019)
With a much larger global warming potential (GWP) and much shorter lifespan, the reduction of methane emissions offers an additional opportunity and a relatively quick way of mitigating climate change in the near future. However, the emissions from c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2f555d1edef9a4d7ba5135bb810ebf01
Publikováno v:
Proceedings of the Combustion Institute. 32:995-1002
This study aims to investigate interactive parallel lean premixed methane flames issued from twin rectangular slot burners with variable jet spacing, equivalence ratios and inlet speeds. The flowfield and combustion chemical reactions are predicted b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2777d6fc9f54e230270440921631f66a
https://doi.org/10.1016/j.proci.2008.07.030
https://doi.org/10.1016/j.proci.2008.07.030
Autor:
Camus Chen, Daniel Lee, Ming-Fan Tsai, Chia-Chu Lai, Ho-chuan Lin, Erico Yang, Min-Han Chuang
Publikováno v:
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
A compact WiFi SiP module using IPD (Integrated Passive Device) Rx Balun is proposed. This WiFi SiP module integrates active chip, RF front end circuit, EEPROM and IPD chip as a full system module that can be easily used for 802.11g WLAN application,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3efc8b977f5b9cb0e871ac28ce1056ed
https://doi.org/10.1109/impact.2013.6706641
https://doi.org/10.1109/impact.2013.6706641
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
With wireless applications flourish like mobile phone, consumer end products must tend to small form factor development. More functions, less dimension, and high integration are future technology trend in chip package development roadmap. Integrated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d99cfcc90e17a704b06a4a2971fa147
https://doi.org/10.1109/impact.2012.6420281
https://doi.org/10.1109/impact.2012.6420281