Zobrazeno 1 - 10
of 92
pro vyhledávání: '"Ho Soon Wee"'
Autor:
Pahwa, Ramanpreet S, Ho, Soon Wee, Qin, Ren, Chang, Richard, Min, Oo Zaw, Jie, Wang, Rao, Vempati Srinivasa, Nwe, Tin Lay, Yang, Yanjing, Neumann, Jens Timo, Pichumani, Ramani, Gregorich, Thomas
Publikováno v:
International Wafer-Level Packaging Conference (IWLPC) 2020
For over 40 years lithographic silicon scaling has driven circuit integration and performance improvement in the semiconductor industry. As silicon scaling slows down, the industry is increasingly dependent on IC package technologies to contribute to
Externí odkaz:
http://arxiv.org/abs/2103.04838
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b87856585ee743acdc3d0e3712fe537
https://doi.org/10.1109/eptc56328.2022.10013294
https://doi.org/10.1109/eptc56328.2022.10013294
Autor:
Teyuh Chou, Wei Tang, Mihai D. Rotaru, Chester Liu, Rahul Dutta, Sharon Lim Pei Siang, David Ho Soon Wee, Surya Bhattacharya, Zhengya Zhang
Publikováno v:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf915032fa27edcb6f0192a7b3266618
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830249
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830249
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdd969a27112f88e3f220106eccc408b
https://doi.org/10.1109/ectc51906.2022.00107
https://doi.org/10.1109/ectc51906.2022.00107
Autor:
Abdul Hannan Yeo, Serine Soh Siew Boon, David Ho Soon Wee, Kalyn Lim Tien Shee, Wei Jun Qi, Zhang Kang, Kelvin Boh Tai Ming, Cheng Ting
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::471b582a3dddeb1183ae7161575a8a9e
https://doi.org/10.1109/eptc53413.2021.9663915
https://doi.org/10.1109/eptc53413.2021.9663915
Autor:
Sharon Pei Siang Lim, Ser Choong Chong, David Ho Soon Wee, Wen Wei Seit, Jacob Jordan Soh, Tai Chong Chai
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f335c12ca48525d43c91fba0d60465b3
https://doi.org/10.1109/eptc53413.2021.9663972
https://doi.org/10.1109/eptc53413.2021.9663972
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aab15c3c1a3191251541414758f968bc
https://doi.org/10.1109/eptc53413.2021.9663883
https://doi.org/10.1109/eptc53413.2021.9663883
Autor:
Richard Chang, Ren Qin, Vempati Srinivasa Rao, Jens Timo Neumann, Ramanpreet Singh Pahwa, Ramani Pichumani, Saisubramaniam Gopalakrishnan, Wang Jie, Haiwen Dai, Oo Zaw Min, David Ho Soon Wee, Tom Gregorich, Ma Tin Lay Nwe
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Deep Learning is being widely used to identify and segment various structures in 2D and 3D scans in fields such as robotics and medical imaging. We leverage this exciting technology to train state-of-the-art models for 3D object detection and segment
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d54f9bfe2de9f5dfb74f4f03209da7eb
https://doi.org/10.1109/ectc32696.2021.00345
https://doi.org/10.1109/ectc32696.2021.00345
Autor:
Surya Bhattacharya, David Ho Soon Wee, Eva Wai Leong Ching, Lim Teck Guan, Jong Ming Ching, Loh Woon Leng
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
A FOWLP and a Si-Interposer integration platform for Electronic IC (EIC) and Photonic IC (PIC) are described here. These two platforms are capable to support high-speed integration and scalable design of the next generation Optical Engine. The integr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da5002c397decbb1f5b166ec098671f5
https://doi.org/10.1109/ectc32696.2021.00050
https://doi.org/10.1109/ectc32696.2021.00050
Autor:
Ren Qin, Ong Ee Ping, David Ho Soon Wee, Huang Su, Haiwen Dai, Vempati Srinivasa Rao, Saisubramaniam Gopalakrishnan, Ramanpreet Singh Pahwa
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Yield improvement is a critical component of semiconductor manufacturing. It is done by collecting, analyzing, identifying the causes of defects, and then coming up with a practical solution to resolve the root causes. Semiconductor components such a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c222c7fc6fd8130725c7d16165c29918
https://doi.org/10.1109/ectc32696.2021.00143
https://doi.org/10.1109/ectc32696.2021.00143