Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Ho Siow Ling"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:1567-1575
A new 3-D model for the die attach (DA) process is established and validated in this paper. With this model, the fluid flow characteristics of the DA process can be predicted accurately. Dynamic mesh and interface tracking method were adopted in the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fcb79a6613a68020305d278da5d3dbb
https://doi.org/10.1109/tcpmt.2016.2606112
https://doi.org/10.1109/tcpmt.2016.2606112
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:1090-1098
Comprehensive numerical and experimental analyses were performed to investigate the issue of die shift during the 12-in wafer level molding process of multichip-embedded wafer level packages. The proposed modeling methodology considers the major mech
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0859f28f87b25ee5b0c711536e06cc1b
https://doi.org/10.1109/tcpmt.2014.2316019
https://doi.org/10.1109/tcpmt.2014.2316019
Autor:
Jerry Aw Jie Li, Ho Siow Ling, Daniel Rhee Min Woo, Lee Jong Bum, Zhang Songbai, Hwang How Yuan
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
The SiC based high power 3 phase inverter module with double side cooling structure was developed. By applying flipchip bonding of SiC based high power DMOSFET device on DBC substrate, the source and gate bonding could be achieved. The drain intercon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5fb339458533445c5db76715d6d8ba50
https://doi.org/10.1109/eptc.2014.7028383
https://doi.org/10.1109/eptc.2014.7028383
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Mechanical and thermal analyses are performed for a power module with target junction temperature of 220°C. The initial design of the package consists of six silicon carbide dies with electrical connections traditionally made by wires being replaced
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4bc37bff961d6b56292e733545a0d88
https://doi.org/10.1109/eptc.2013.6745770
https://doi.org/10.1109/eptc.2013.6745770
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
Due to different demands, there are many types of die attach technologies in the market. In this work, die attach materials such as solder, silver filled epoxies and sintered silver are investigated for their mechanical performance under standard pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7036e829704ed8b9967e05f5210cb2d
https://doi.org/10.1109/eptc.2012.6507063
https://doi.org/10.1109/eptc.2012.6507063
Akademický článek
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Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC); 2014, p747-751, 5p
Akademický článek
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Autor:
Ho, Siow Ling, Tay, Andrew A. O.
Publikováno v:
2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p807-812, 6p
Publikováno v:
2012 IEEE 62nd Electronic Components & Technology Conference; 1/ 1/2012, p1493-1498, 6p