Zobrazeno 1 - 10
of 31
pro vyhledávání: '"Ho Hyung Lee"'
Publikováno v:
Archives of Plastic Surgery, Vol 51, Iss 01, Pp 094-101 (2024)
Background For the small glabrous skin defect, Thenar and Hypothenar skin are useful donors and they have been used as a free flap. Because of similar skin characteristics, both flaps have same indications. We will conduct comparative study for the d
Externí odkaz:
https://doaj.org/article/a664ef3cc4f343a4a83387aebee531c1
Publikováno v:
Archives of Plastic Surgery, Vol 51, Iss 01, Pp 087-093 (2024)
This study aimed to analyze cases of anterolateral thigh (ALT) free flap used for hand reconstruction with terminal perforator-to-digital artery anastomosis. Patients who underwent ALT free flap placement with terminal perforator-to-digital artery an
Externí odkaz:
https://doaj.org/article/8d18bc5e3777454d8eae583d29818946
Autor:
Hag-min Kim, Ho-hyung Lee
Publikováno v:
Journal of Korea Trade, 2016, Vol. 20, Issue 1, pp. 2-20.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/JKT-03-2016-001
Autor:
Ho Hyung Lee, Jae B. Kwak
Publikováno v:
Journal of Electronic Materials. 48:6857-6865
Creep tests were performed using a fixture composed of a spring, a micrometer and a heating pad to apply both heat and constant compressive load and elevated temperature to the actual solder joint. A microscopic digital image correlation technique wa
Autor:
Gamal Refai-Ahmed, Myongseob Kim, Henley Liu, Hong Shi, Suresh Ramalingam, Ho Hyung Lee, Boon Y. Ang, Jaspreet S. Gandhi, Tom Lee
Publikováno v:
International Symposium on Microelectronics. 2017:000336-000341
FPGA partitioning and high density integration using interposer based 2.5D stacked silicon interconnect technology (SSIT) has been the pioneering work at Xilinx for several years enabling advanced applications in high performance computing, networkin
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Power density growth of the IC packages highlighted the importance of the thermal management. While there are dimensional limitations in designing the thermal solution, it is known that conductivity of the TIM plays a primary role to improve the ther
Publikováno v:
Journal of Korean Society of Hazard Mitigation. 16:297-305
Autor:
Ho-Hyung Lee, Hag-Min Kim
Publikováno v:
Journal of Korea Trade. 20:2-20
Purpose – E-Trade (paperless trade or cross-border e-commerce in B2B format) does not necessarily show positive results. The purpose of this paper is to conceptualize why and how such happens and furthermore, has two research purposes. First is to
Autor:
Scott McCann, Yuling Niu, Stephen R. Cain, Seungbae Park, Gamal Refai-Ahmed, Jiefeng Xu, Ho Hyung Lee
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In this study, an electromigration (EM) experiment of a ball in a flip chip package with eutectic SnPb solder has been performed. The test vehicles had two types of ball grid array (BGA) interconnects between the traces: one with Cu via and one witho
Autor:
Ho-Hyung Lee
Publikováno v:
International Commerce and Information Review. 17:307-327