Zobrazeno 1 - 10
of 69
pro vyhledávání: '"Ho Gyeong Yun"'
Autor:
Ho-gyeong Yun
Publikováno v:
Korean Literature Education Research. 78:121-161
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68f963ab3b99b4c5d1f5310ad6a2822b
https://doi.org/10.37192/kler.78.4
https://doi.org/10.37192/kler.78.4
Autor:
Ji Yoon Kim, Ho Gyeong Yun
Publikováno v:
The Journal of General Education. 22:189-236
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::526c572ad1782acaa9118189a8b39e56
https://doi.org/10.24173/jge.2023.01.22.7
https://doi.org/10.24173/jge.2023.01.22.7
Publikováno v:
THE JOURNAL OF HUMANITIES STUDIES. 127:171-210
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::70779a61749ecc7514352380e3184bff
https://doi.org/10.46346/tjhs.127..7
https://doi.org/10.46346/tjhs.127..7
Autor:
Ho-gyeong Yun
Publikováno v:
Korean Language Education. 173:155-193
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ac2dcdb4c98edd6fa65ed2a013ce938
https://doi.org/10.29401/kle.173.6
https://doi.org/10.29401/kle.173.6
Autor:
Ho-Gyeong Yun, Ji-Woong Choi, Ki-Seok Jang, Yong-Sung Eom, Kwang-Seong Choi, Seok Hwan Moon, Gwang-Mun Choi, Chanmi Lee, Jiho Joo, Ji-Hoon Choi
Publikováno v:
SID Symposium Digest of Technical Papers. 52:841-844
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::979ef0fd9a1fa989c2983b30c6dcb2d5
https://doi.org/10.1002/sdtp.14814
https://doi.org/10.1002/sdtp.14814
Autor:
Kwang-Seong Choi, Jiho Joo, Gwang-Mun Choi, Ho-Gyeong Yun, Seok Hwan Moon, Ki-seok Jang, Chanmi Lee, Jin-Hyuk Oh, In-Seok Kye, Yoon-Hwan Moon, Yong-Sung Eom
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aae1e772606cce0eecc6225c0b6a57eb
https://doi.org/10.1109/ectc51906.2022.00042
https://doi.org/10.1109/ectc51906.2022.00042
Autor:
Ho-Gyeong Yun
Publikováno v:
Korean Literature Education Research. 68:155-185
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63e5319276a47a5eae9754125ca43a0c
https://doi.org/10.37192/kler.68.5
https://doi.org/10.37192/kler.68.5
Autor:
Jiho Joo, Ho-Gyeong Yun, Ki-Seok Jang, Gwang-Mun Choi, Chanmi Lee, Yong-Sung Eom, Seok Hwan Moon, Ji-Woong Choi, Kwang-Seong Choi, Ji-Hoon Choi
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The transfer process of moving individual micro-LED chips to a display substrate has been regarded as the biggest technical obstacle for the commercialization of displays based on micro-LEDs. To date, various candidate technologies have not been able
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f8276a345a31b592bc1575eeae6c582
https://doi.org/10.1109/ectc32696.2021.00255
https://doi.org/10.1109/ectc32696.2021.00255
Autor:
Jiho Joo, Yong-Sung Eom, Gwang-Mun Choi, Ho-Gyeong Yun, Kwang-Seong Choi, Seok Hwan Moon, In-seok Kye, Chanmi Lee, Ki-Seok Jang
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
We have transferred and bonded a $\mu \text{LED}$ array to the patterned substrate using SITRAB (Simultaneous transferring and bonding) and ASP (Anisotropic Solder Paste). ASP contained epoxy as a base matrix, solder powder, and a small fraction of p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d10ea2e5c627e083729b38f3dc45b1f0
https://doi.org/10.1109/ectc32696.2021.00119
https://doi.org/10.1109/ectc32696.2021.00119
Autor:
Gwang-Mun Choi, Yong-Sung Eom, Chanmi Lee, Kwang-Seong Choi, Ho-Gyeong Yun, Jiho Joo, Ki-Seok Jang
Publikováno v:
Polymers, Vol 13, Iss 957, p 957 (2021)
Polymers
Volume 13
Issue 6
Polymers
Volume 13
Issue 6
An epoxy-based solder paste (ESP) is a promising alternative to conventional solder pastes to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the solder joint. However, development of an appropriate epoxy formu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::164d8dbe2a2a8d1ee4744e4d63584e78
https://www.mdpi.com/2073-4360/13/6/957
https://www.mdpi.com/2073-4360/13/6/957