Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Hitoshi Onozeki"'
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Die position accuracy is one of the important topics of the fabrication processes of die first fan out packages (FO-PKG). In this research, the die position accuracy and the compensation were studied by the combined approach of the sample preparation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6eeda25a91e7d87d0fdf5128829dbd2
https://doi.org/10.1109/eptc.2018.8654304
https://doi.org/10.1109/eptc.2018.8654304
Autor:
Hiromichi Aoki, Hitoshi Onozeki, Toshihisa Nonaka, Tsuyoshi Ogawa, Mitsuki Nakata, Naoya Suzuki, Kohei Mizuno
Publikováno v:
2018 International Wafer Level Packaging Conference (IWLPC).
The re-distribution layer (RDL) first type fan out technology is expected to be used for the advanced packages with fine pitch wiring such as side by side die to die interconnection. To demonstrate the fabrication of RDL-first Fan out- Panel level pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b689fccbad1eb7793d3e4d2cefd673a
https://doi.org/10.23919/iwlpc.2018.8573282
https://doi.org/10.23919/iwlpc.2018.8573282
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
New high speed die stacking process using the originally designed stabbing pad combined with mass reflow for 2.5D and 3D has been developed. The top die having the bump of Cu pillar and solder cap was picked and placed on the bottom die which has the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f3750a28e007581b76ed7cf53eaabba
https://doi.org/10.1109/ectc.2018.00235
https://doi.org/10.1109/ectc.2018.00235
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
"Molded reflow process" which is novel high productive 3D stacking process has been developed. The process is a serial process of the first step of chip pre-bonding on the wafer, the second step of resin over-molding and the third step of connection
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a7c73ee70d3772d3491a1c1aa2cf3a7
https://doi.org/10.1109/ectc.2017.116
https://doi.org/10.1109/ectc.2017.116
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
We propose a 2.1-D SiP that uses an organicinterposer for HBM applications and describe a demonstration of the technology. This SiP structure consists of a newly developed thin photosensitive insulation film multilayer (organic interposer) on a conve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b940f887bb682145dbb20df8f2b7b7a4
https://doi.org/10.1109/ectc.2017.34
https://doi.org/10.1109/ectc.2017.34
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
In plane collective bonding by NCF-TCB with the film inserted between the die and the substrate, which had a significant potential to enhance the productivity, was studied. PTFE and the newly developed film which consisted of thermosetting resin laye
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::854dfbdb9a2446ceb21481417d286c51
https://doi.org/10.1109/ectc.2016.120
https://doi.org/10.1109/ectc.2016.120
Autor:
Yamagishi Katsuji, Nobuyuki Ogawa, Hitoshi Onozeki, Kenichi Ikeda, Takahiro Tanabe, Takayuki Suzuki, Inoue Tsubasa
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
The demand for downsized and light-weighted electronic parts has become stronger to realize the higher electrical performance and smaller size of electronic equipment. Thus, the package substrate used in electronics is demanded to be thinner and high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92d23ea33c3b41202c274311f947f6f7
https://doi.org/10.1109/ectc.2013.6575743
https://doi.org/10.1109/ectc.2013.6575743
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
A new profile-free copper foil has been developed whose surface roughness is Rz
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::957f23ba975f109499b6716d3703203c
https://doi.org/10.1109/ectc.2005.1441305
https://doi.org/10.1109/ectc.2005.1441305