Zobrazeno 1 - 10
of 140
pro vyhledávání: '"Hitoshi, Hoshino"'
Autor:
Domenico Giusti, Hitoshi Hoshino, Gerald Klug, Fabio Quaglia, Hideyuki Sandoh, Mark Shaw, Masatoshi Wakahara
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Publikováno v:
Journal of Separation Science. 43:657-662
The significant demands for single nucleotide polymorphism detection and genotyping assays have grown. Most common assays are based on the recognition of the target sequence by the hybridization with its specific probe having the complementary sequen
Autor:
Seon Tae Kim, Yoshiro Tamura, Masaki Kurihara, Yukitaka Kato, Hitoshi Hoshino, Hiroki Takasu, Chisato Kurahashi, Shusuke Saito, Chiharu Takahashi
Publikováno v:
ISIJ International. 59:721-726
Publikováno v:
Applied Energy. 240:1-5
High-temperature thermal energy can be produced from renewable power sources such as high-temperature gas-cooled reactors and high-temperature thermal processes, without environmental pollution. Integration of thermochemical energy storage (TcES) sys
Publikováno v:
ISIJ International. 59(No. 4):715-720
Autor:
Hitoshi Hoshino
Publikováno v:
Journal of Nepal Medical Association, Vol 34, Iss 117 (2013)
Abstract
Externí odkaz:
https://doaj.org/article/8e8d61aeeac942caad3056f00cdce67d
Autor:
Shigehiko Funayama, Hitoshi Hoshino, Hiroki Takasu, Yukitaka Kato, Naoto Uchiyama, Yoshirou Tamura
Publikováno v:
Ceramics International. 44:11835-11839
With the aim of investigating the reaction mechanism of the carbonation of Li4SiO4, a kinetic analysis was performed using the shrinking core model. Isothermal experiments were conducted with Li4SiO4 samples at ten different target temperatures betwe
Publikováno v:
Journal of Separation Science. 40:3153-3160
Separation of single-base substitution sequential DNA isomers remains one of the most challenging tasks in DNA separation by capillary electrophoresis. We developed a simple, versatile capillary electrophoresis technique for the separation of single-
Publikováno v:
Energy Storage. 1
Autor:
Samuel Suhard, Fumihiro Inoue, Hitoshi Hoshino, Alain Phommahaxay, Eric Beyne, Andy Miller, Kenneth June Rebibis, Berthold Moeller, Arnita Podpod, Erik Sleeckx
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Feasibility study of alternative dicing technologies for collective die to wafer direct bonding combined with wafer to wafer direct bonded dies has been performed. Several dicing technologies such as blade dicing, laser grooving + plasma dicing, lase