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pro vyhledávání: '"Hisaya Sonoda"'
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Thick copper wiring on ferrite/epoxy resin substrate was carried out by laser sintering of the paste prepared with 1 μm-diameter copper micro-particles and organic solvents. A 532 nm-wavelength Nd:YVO4 green laser has a high adsorption both to the c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac8940fedd0e51e57789c31108dace3b
https://doi.org/10.1109/eptc.2016.7861494
https://doi.org/10.1109/eptc.2016.7861494
