Zobrazeno 1 - 10
of 73
pro vyhledávání: '"Hisashi Tanie"'
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 86, Iss 883, Pp 19-00330-19-00330 (2020)
Various bonding materials have been developed for power semiconductor products. However, the fatigue characteristics of many of these materials are difficult to evaluate uniformly using a conventional test, and this difficulty represents an obstacle
Externí odkaz:
https://doaj.org/article/7c46568ce2e6458b8f9fc65d6c0908b5
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 81, Iss 831, Pp 15-00446-15-00446 (2015)
The purpose of this study is to investigate the dominant factor on the fracture strength of thin film comprising of copper (Cu) helical nano-elements, which are grown by the glancing angle deposition technique. By changing the deposition angle in the
Externí odkaz:
https://doaj.org/article/5ffb89839721426a9069d0576cc55564
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 81, Iss 824, Pp 15-00018-15-00018 (2015)
A Kriging-based method for efficiently searching materials was used to select additive elements in lead-free solders that are effective for suppressing the grain-boundary diffusion, which is the cause of smaller breaking elongation than lead-containe
Externí odkaz:
https://doaj.org/article/8d860fdaa4944a5db8a8df75911bf57a
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 22:112-118
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d824cd77105bc8ed4694e82cb526146
https://doi.org/10.5104/jiep.22.112
https://doi.org/10.5104/jiep.22.112
Publikováno v:
Journal of Smart Processing. 5:251-258
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::037f93a15c9027b770a34cfb574bd065
https://doi.org/10.7791/jspmee.5.251
https://doi.org/10.7791/jspmee.5.251
Publikováno v:
The Proceedings of the Materials and Mechanics Conference. 2015:GS0503-39
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b02f01a6b3af35b4078183c98c2b3db4
https://doi.org/10.1299/jsmemm.2015._gs0503-39
https://doi.org/10.1299/jsmemm.2015._gs0503-39
Publikováno v:
Transactions of the JSME (in Japanese). 81:15-00018
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67aa1e5c06819ff4833bd48ca2e609b0
https://doi.org/10.1299/transjsme.15-00018
https://doi.org/10.1299/transjsme.15-00018
Publikováno v:
Key Engineering Materials. 626:178-181
The cyclic growth and recovery of warpage were observed in experiments on Si/solder/Cu layered plates subjected to cyclic thermal loading [1]. In the present study, the experiments were analyzed using representative material models for the solder and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d6634dda2363dbd24405c74d6cde5e3
https://doi.org/10.4028/www.scientific.net/kem.626.178
https://doi.org/10.4028/www.scientific.net/kem.626.178
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 17:123-131
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb676553094d34ac9da2c48c2a564e7a
https://doi.org/10.5104/jiep.17.123
https://doi.org/10.5104/jiep.17.123
Autor:
Hisashi Tanie, Hiroshi Shintani
Publikováno v:
The Proceedings of the Materials and Mechanics Conference. 2019:OS0406
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a10dfec503940b2ce1ac13d74ca302b
https://doi.org/10.1299/jsmemm.2019.os0406
https://doi.org/10.1299/jsmemm.2019.os0406